Taiwan Semiconductor Manufacturing Comp. Ltd.

Wei-Ting Hsiao

Hsu-Shui Liu

Yang-Ann Chu

Tsung-Sheng Kuo

Hsuan Lee

Chih-Chang Hsieh

Chih-Ping Chen

Chih-Kuo Chang

Yung-Kai Lin

I-Lun Yang

Kai-Chieh Huang

Kai Lo

Chung-Chieh Hsu

Chung-chieh Hsu

Chian-kun Chan

Chian-Kun Chan

Apparatus and methods for handling die carriers are disclosed. In one example, a disclosed apparatus includes: a load port configured to load a die carrier operable to hold a plurality of dies into a processing tool; and a lane changer coupled to the load port and configured to move at least one die in the die carrier to an input of the processing tool and transfer the at least one die into the processing tool for processing the at least one die.

Apparatus and methods for handling die carriers

An apparatus and method for processing semiconductor substrates provides a substrate stage being a rotatable disc with a solid surface and a terraced edge with upper, intermediate and lower portions of increasing diameter. A hollow edge ring rests on the intermediate edge portion and a substrate disposed on the rotatable disc is lifted and transported by robot blades positioned beneath the edge ring and which lift the edge ring which holds the substrate around its edges. The rotatable disc and edge ring find application in MOCVD and other semiconductor manufacturing tools.

Semiconductor apparatus with transportable edge ring for substrate transport

Growing community of inventors

Taichung, Taiwan

Wei-Ting Hsiao