Taiwan Semiconductor Manufacturing Comp. Ltd.

Wei-Ti Hsu

Chi-Hung Liao

Kuei-Shun Chen

Shih-Chi Fu

Tzong-Sheng Chang

Fei-Gwo Tsai

Jui-Ping Chuang

Meng-Wei Chen

Hsueh-Yi Chung

Yung-Cheng Chen

Shin-Puu Jeng

Hao-Yi Tsai

Shang-Yun Hou

Chia-Lun Tsai

Chun-Jen Chen

Shih-Hsun Hsu

Lin-Ko Feng

Yung-cheng Chen

A method includes receiving a device design layout and a scribe line design layout surrounding the device design layout. The device design layout and the scribe line design layout are rotated in different directions. An optical proximity correction (OPC) process is performed on the rotated device design layout and the rotated scribe line design layout. A reticle includes the device design layout and the scribe line design layout is formed after performing the OPC process.

Method of fabricating reticle

A method for exposing a wafer substrate includes forming a reticle having a device pattern. A relative orientation between the device pattern and a mask field of an exposure tool is determined based on mask field utilization. The reticle is loaded on the exposure tool. The wafer substrate is rotated based on an orientation of the device pattern. Radiation is projected through the reticle onto the rotated wafer substrate by the exposure tool, thereby imaging the device pattern onto the rotated wafer substrate.

Exposure method of wafer substrate, manufacturing method of semiconductor device, and exposure tool

A semiconductor wafer structure includes a plurality of dies, a first scribe line extending along a first direction, a second scribe line extending along a second direction and intersecting the first scribe line, wherein the first and the second scribe lines have an intersection region. A test line is formed in the scribe line, wherein the test line crosses the intersection region. Test pads are formed in the test line and only outside a free region defined substantially in the intersection region.

Test line placement to improve die sawing quality

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Hsinchu County, Taiwan

Wei-Ti Hsu