San Fang Chemical Industry Company, Ltd.

Bestac Advanced Material Co., Ltd.

Wei-Te Liu

Chung-Chih Feng

I-Peng Yao

Yung-Chang Hung

Lyang-Gung Wang

Wen-Chieh Wu

Chun-Ta Wang

The present invention relates to a polishing having a polishing layer, an elastic base layer and a binder layer. The binder layer binds the elastic base layer to the polishing layer. A compressibility of the elastic base layer is greater than a compressibility of the polishing layer. The present invention further provides a polishing apparatus and a method for polishing a substrate.

Polishing pad and polishing apparatus

The present invention relates to a polishing pad comprising a buffer sheet containing a pressure distribution sheet. The invention also relates to a polishing apparatus and a method for manufacturing a polishing pad.

Polishing pad, polishing apparatus and method for manufacturing polishing pad

The present invention relates to a polishing pad comprising a base sheet containing a restriction layer. The invention also relates to a polishing apparatus and a method for manufacturing a polishing pad.

The present invention relates to a sheet for mounting a workpiece, which includes a sheet body. The sheet body includes a top surface, a plurality of foamed pores, and a plurality of surface holes or at least one surface groove. The top surface is used for mounting a workpiece. The foamed pores are disposed in the interior of the sheet body. The surface holes or the surface groove have opening on the top surface but does not communicate with the foamed pores. The surface holes or the surface groove is formed by machining, and arranged in at least one pattern. Whereby, the time for taking off the workpiece from the sheet is reduced.

Sheet for mounting a workpiece

A groove structure for avoiding stripping of a polishing surface of a polishing pad, the polishing pad including a base material and a grinding layer. The base material has a surface. The grinding layer is disposed on the surface, and part of the surface around the edge of the base material is exposed. The grinding layer has a plurality of first grooves and second grooves, and the first grooves cross the second grooves to define a plurality of grinding areas. The exposed part of the surface around the edge of the base material is located between the first grooves, the second grooves and the edge of the polishing pad. The polishing pad contains more grinding liquid, to clean the small grinded pieces. The grinding layer does not have an acute structure and is not easily peeled to form the small grinded pieces. Therefore, grinding quality and grinding effect are improved.

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Kaohsiung, Taiwan

Wei-Te Liu