Foxconn Precision Components Co., Ltd.

Hon Hai Precision Industry Co., Ltd.

Wei-Ta Lo

Chao-Yang Lee

Chung-Yung Sun

Chao Kun Tseng

Chung-Tung Sun

Chung-Yuan Huang

A heat sink for dissipating heat generated by an integrated circuit package includes a flat basetwo vertical U-shaped heat pipesand a heat dissipation body. The heat dissipation body includes a pair of side platesand a plurality of finssandwiched between the side platesEach heat pipehas a horizontal heat absorbing portionattached to the baseand two heat dissipation portionsextending perpendicularly from opposite ends of the heat absorbing portionand through the side plates

Heat sink with heat pipes

A heat sink clip includes a main body ( ), and an operating body ( ) rotatably attached to the main body. The main body includes a central portion ( ), and two clipping portions ( ) depending from opposite ends thereof. Two mounting portions ( ) depend from the main body. A claw ( ) is formed on each mounting portion. The operating body includes a shaft ( ) rotatably received in the claws of the main body, and a handle ( ) perpendicularly extending from one end of the shaft. A cam ( ) is formed on the shaft. Two annular recesses ( ) are defined in the shaft at opposite sides of the cam, the recesses rotatably receiving the claws. If the operating body needs to be replaced with another operating body having a different sized cam, the operating body is easily pulled out from the claws.

Heat sink clip with interchangeable operating body

A clip ( ) adapted to attach a heat sink ( ) to an electronic device ( ) includes a body ( ) and a lever ( ). The lever is fastened to the body with a pivot ( ). The lever includes a pressing portion ( ) and a bore ( ). First and second contact points ( ) are defined at a lower edge of the pressing portion at different distances from the bore. The clip is initially placed in a groove ( ) of the heat sink, whereupon the first contact point abuts a top surface of the groove. When the lever is fully depressed, the second contact point firmly abuts the top surface of the groove. Thus the clip securely attaches the heat sink to the electronic device.

Clip for heat sink

A heat dissipating assembly includes a heat sink ( ) and a pair of clips ( ). The heat sink has a base ( ) defining a pair of slots ( ) spaced from each other, and a plurality of fins ( ) extending from a top surface of the base between the slots. The clip defines a pressing body ( ) and two legs ( ) extending from opposite ends of the pressing body, each leg defining an aperture ( ). A horizontal portion ( ) formed at the middle of the pressing body forms a U-shaped hook ( ) extending downward from one side edge thereof. The hook is elastically deformable to be engagingly and interferentially received in the slot of the base of the heat sink for attaching the clip to the heat sink. The assembly is a singe unit ready to be conveniently mounted onto an electronic device.

Ready-to-mount heat dissipating assembly

A heat sink assembly for an electrical socket of the present invention comprises a heat sink and a latching member latching with a pair of lugs on the socket. The heat sink comprises a base plate and a plurality of fins projecting upward therefrom. A receiving channel is integrally formed between the fins in the base plate for receiving the latching member. A pair of positioning tabs depends downward from a bottom surface of the base plate to tightly engage in a slit between the electric socket and a CPU mounted thereon for positioning the heat sink assembly on the CPU and keeping it from moving along the CPU. The receiving channel and the fins extend in a first direction while the tabs extend in a second direction vertical to the first direction.

Heat sink assembly for dissipating heat of an electronic package mounted on an electrical socket

A heat dissipation assembly ( ) includes a heat sink ( ) and a metal plate ( ). The heat sink includes a chassis ( ) and a plurality of fins ( ). The chassis forms a pair of tabs ( ) depending from each of two opposite sides of a bottom surface ( ) of the chassis. First and second flanges ( ) respectively depend from the opposite sides, between the tabs. A material ( ) with low thermal resistance is arranged between the metal plate and the chassis. The metal plate is attached to the bottom surface of the chassis. The flanges are bent inwardly to fasten the metal plate to the chassis.

Heat dissipation assembly

A heat sink clip ( ) includes a spring portion ( ) and two arms ( ) extending from respective opposite ends of the spring portion. The spring portion has a horizontal portion ( ) which forms a tab ( ) extending horizontally and then downwardly from a side edge of the horizontal portion. The tab defines a positioning hole ( ) for engaging with a catch ( ) formed on a side wall of a retention module ( ). Each arm defines an aperture ( ) for engaging with a beam ( ) formed on each end of the retention module. The end of each arm extends outward to form a T-shaped handle ( ). The handle includes an L-shaped connecting portion ( ) and an L-shaped operation portion ( ).

Heat sink clip

A heat dissipating assembly ( ) includes a heat sink ( ), a pair of clips ( ), and a pair of holders ( ). The heat sink includes a chassis ( ) defining a pair of slots ( ) spaced from each other and a plurality of fins ( ) extending from the chassis between the slots. Each clip includes a central horizontal portion ( ), two pressing bodies ( ) extending from respective sides of the horizontal portion, and two legs ( ) extending from respective distal ends of the pressing bodies. Each leg defines an aperture ( ). Each holder has a tab ( ) and a U-shaped hook ( ) depending perpendicularly from respective opposite ends thereof. Each hook is elastically deformable to be engagingly received in the slot of the chassis. The horizontal portion of each clip is located between the tab and the hook of the holder, whereby the clip is attached to the heat sink by the holder. The apertures of the clips are captured by catches ( ) of a retention module ( ) mounted on an electronic device, so that the heat dissipating assembly is firmly mounted to the electronic device.

Heat dissipating assembly

A heat sink assembly includes a fan, a heat sink, and a fixing device which attaches the fan to the heat sink. The heat sink has a plurality of fins. Four catches are respectively formed on four outermost fins, two on each of two longitudinal sides of the base. The fixing device has a base and four legs depending from respective corners of the base. A pair of protrusions depends from the base near respective lateral sides of the base. Four poles extend upwardly from the base near respective corners of the base. Each leg defines an aperture for engaging with the corresponding catch of the heat sink. The fan defines four through holes for respectively receiving the poles of the fixing device.

Heat sink assembly

A heat sink clip ( ) includes a body ( ) and a fastener ( ). The body includes a spring portion ( ) positioned above a heat sink, and two legs ( ) extending from opposite ends of the spring portion. Each leg defines an aperture ( ) for engaging a catch of a retention module mounted beside an electronic device. The spring portion has a horizontal section ( ) which forms a spring tongue ( ). A pair of L-shaped guiding tabs ( ) is formed under and spaced from the horizontal section, with a space defined between the horizontal section and the guiding tabs. A gap ( ) is formed between the guiding tabs. The fastener includes an operation portion ( ), and a connecting portion ( ) for insertion in the space between the horizontal section and the guiding tabs. The connecting portion defines a slot ( ) for engagement with the spring tongue of the body. A spring tab ( ) is formed under the connecting portion. The spring tab elastically deforms, thereby exerting a spring force between the heat sink and the clip, and thus securely attaching the heat sink to the electronic device.

A heat sink assembly for an electrical socket of the present invention comprises a heat sink and a latching member latching with a pair of lugs on the socket. The heat sink comprises a base plate and a plurality of fins projecting upward therefrom. A receiving channel is integrally formed by a pressing means between the fins in the base plate for receiving the latching member. A pair of positioning pins depend downward from a bottom surface of the base plate to tightly engage in a slit between the electric socket and a CPU mounted thereon for positioning the heat sink assembly on the CPU and keeping it from moving along the CPU.

Heat sink assembly for an electrical socket

A heat sink assembly includes a heat sink, a clip and a fastener. The heat sink includes a base and a plurality of fins extending upwardly from the base. A slot is defined between the fins. Grooves are defined on opposite sides of a particular row of the fins. The clip defines a spring portion received in the slot of the heat sink. The curved fastener forms a pair of projections with a gap defined therebetween extending inwardly from both ends of the fastener for engaging the corresponding grooves of the heat sink. A tab is defined on one side of the fastener for engagement with an edge of one of the fins.

A clip includes a pin (,) and a leaf spring (,). The pin includes a columnar body (,), an expanded head (,) formed at a top end of the body, and a cone-shaped plug (,) formed at a bottom end of the body opposite the head. A slot (,) is defined through the plug and a bottom portion of the body, to enable the plug to elastically deform. The plug is thus adapted for extending through a heat sink and engaging with a printed circuit board. A flange (,) extends perpendicularly from the body between the head and the plug. The leaf spring includes a base (,), with an opening (,) defined therein for extension of the pin therethrough. A pair of inflexed prolongations (,) extends progressively downwards from opposite corners of the base, with the width of each prolongation being less than half the width of the base.

Clip for securing heat sink to electronic device package

A clip assembly (,) for mounting a heat sink (,) to an electronic device (,) retained on a socket connector (,) includes a clip (,) and a fastener (,). The clip has an elongate spring portion (,) engaging a surface of the heat sink and two legs (,) extending from the spring portion for engaging with catches (,) of the socket connector, thereby securing the heat sink to the electronic device. The fastener includes a pair of latches (,) and a resilient connecting section (,) connected between the latches. Each latch has a protrusion (,) extending from a distal end thereof, each protrusion extending towards the opposite protrusion. The heat sink forms a plurality of fins (,) defining a slot (,) therebetween for receiving the clip and the fastener. The latches are configured to engage with grooves (,) defined in fins on opposite sides of the slot of the heat sink, thereby securely attaching the clip to the heat sink and effectively eliminating relative movement between the clip and the heat sink.

Heat sink clip assembly

A heat sink device for a chip comprises a heat sink, a pair of mounting portions and a pair of fixing bolts. The heat sink includes a base, a plurality of fins and a pair of tabs symmetrically extending from opposite corners thereof and having a hole. Each mounting portion includes a main body, a resilient arm upwardly and inwardly extending from an end of the main body and a pair of clamping portions extending from the edges of the main body. Apertures defined in the main bodies and openings defined in the resilient arms correspond to the holes of the tabs. Each fixing bolt includes a cap, a beam, a latch and a step.

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Miou-Li, Taiwan

Wei-Ta Lo