Honeywell International Inc.

Stats Chippac Pte. Ltd.

Sap Se

Ethicon Endo-surgery, Inc.

Psa Automobiles Sa

Honeywell Safety Products Usa, Inc.

Stellantis Auto Sas

Wei Sun

Lei Jiang

Yongjun Chen

John Jenkins

Scott Hutt

Li-Jen Lin

Shan Wan

Bing Li

Stephen A Murphy

Feng Cao

Xiangchun Hong

Junyan Xu

Xiaoxia Shen

Lian Xu

Zhixiong Hou

Lihua Zhang

Yao Yu

Zi Ye Wang

Hongri Wang

Sebastien Chopard

Virginie Huguon

Cai Yun Li

Junlong Yin

Yuan Yuan Zhu

A protection cup for a hearing protection device (HPD) is provided. The protection cup includes a plurality of fractal elements disposed on an inner surface of the protection cup.

Apparatuses, systems, and methods for increasing or manipulating noise attenuation in hearing protection device

A protection cup () for a hearing protection device (HPD) and a method for manufacturing a protection cup (). The protection cup () includes a plurality of fractal elements disposed on an inner surface () of the protection cup ().

Various examples described herein are directed to systems and methods for interfacing an analytics computing system with a remote resource. An analytics computing system may access data describing a multi-resource operation. The analytics computing system may execute a multi-resource application programming interface (API) service. The multi-resource API service may send a first trigger message to a public API of the first remote resource. The analytics computing system may send first data to the remote resource and may receive, from the remote resource, first result data describing a result of the first action performed at the first remote resource using the first data.

Multi-resource operations in an analytics computing system

Hearing protection device

Methods, apparatuses, and systems for detecting internal defects of a protective headgear are provided. An example apparatus may include a protective headgear, an actuator element integrated within the protective headgear, a sensor element integrated within the protective headgear, and a processor element electronically coupled to the actuator element and the sensor element. In some examples, the processor element is configured to cause the actuator element to generate a first ultrasonic wave, wherein the first ultrasonic wave is propagated in the protective headgear, and receive a first output from the sensor element in response to the first ultrasonic wave.

Method, apparatus and system for detecting internal defect in protective headgear

The present invention provides a linear stapler having a multi-functional retaining pin subassembly. The linear stapler comprises a handle stem connecting an anvil to a handle, and the retaining pin subassembly is movably supported on the handle stem and comprises a connecting cover having a retaining pin extending from the connecting cover. The present invention also provides a multi-functional retaining pin subassembly. The retaining pin subassembly can achieve cartridge alignment and tissue retention during the firing of the stapler and protect tissue from unintended damage.

Linear stapler with a multi-functional retaining pin subassembly

A semiconductor device has a substrate with a contact pad. A first insulation layer is formed over the substrate and contact pad. A first under bump metallization (UBM) is formed over the first insulating layer and is electrically connected to the contact pad. A second insulation layer is formed over the first UBM. A second UBM is formed over the second insulation layer after the second insulation layer is cured. The second UBM is electrically connected to the first UBM. The second insulation layer is between and separates portions of the first and second UBMs. A photoresist layer with an opening over the contact pad is formed over the second UBM. A conductive bump material is deposited within the opening in the photoresist layer. The photoresist layer is removed and the conductive bump material is reflowed to form a spherical bump.

Semiconductor device and method of forming a dual UBM structure for lead free bump connections

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Shanghai, China

Wei Sun