Meta Platforms Technologies, LLC

Plessey Semiconductors Limited

Wei Sin Tan

Andrea Pinos

Samir Mezouari

John Lyle Whiteman

Xiang Yu

Simon Ashton

Sean Denis Connor

Kathleen Bonnie Vinden

Jun Youn Kim

A micro-light emitting diode (micro-LED) device includes a plurality of semiconductor epitaxial layers that includes a quantum well layer configured to emit light. The micro-LED device also includes an array of electrodes for an array of micro-LEDs, the array of electrodes coupled to the plurality of semiconductor epitaxial layers. The micro-LED device further includes an insulator grid coupled to the plurality of semiconductor epitaxial layers and positioned in regions between individual electrodes of the array of electrodes, and a gate grid coupled to the insulator grid and configured to apply an electric field through the insulator grid to the plurality of semiconductor epitaxial layers in the regions between the individual electrodes of the array of electrodes to electrically isolate the plurality of semiconductor epitaxial layers into individual micro-LEDs of the array of micro-LEDs.

Micro-LED with field-effect isolation

A light emitting diode structure comprising: a p-type region; an n-type region; a gate contact; a first light emitting region for recombination of carriers injectable by the p-type region and the n-type region; and a second light emitting region for recombination of carriers injectable by the p-type region and the n-type region, wherein the first light emitting region and the second light emitting region at least partially overlap to form a light emitting surface associated with the first light emitting region and the second light emitting region; wherein the p-type region is at least partially formed in a first channel through the first light emitting region and the second light emitting region, and the n-type region is at least partially formed in a second channel through the first light emitting region and the second light emitting region, wherein the light emitting device is configured such that the wavelength of light emitted by the light emitting surface is controllable by varying a gate voltage applied to one of the p-type and n-type regions by the gate contact thereby to alter carrier injection by the p-type and n-type regions into the first and second light emitting regions.

Voltage-controllable monolithic native RGB arrays

Disclosed herein are a light source for a display system and methods of fabricating the light source. The light source includes a backplane wafer including a first bonding layer that includes an array of pixel contact pads in a first dielectric layer; a second bonding layer including an array of small metal contact pads in a second dielectric layer; and an array of mesa structures on the second bonding layer and configured to emit light. The second dielectric layer is bonded to the first dielectric layer such that each pixel contact pad of the array of pixel contact pads is in contact with two or more small metal contact pads that are electrically coupled to a same mesa structure of the array of mesa structures.

Alignment-free micro-display architecture

A light source comprises a backplane wafer with electrical circuits fabricated thereon, and an array of LEDs coupled to the backplane wafer. Each LED of the array of LEDs comprises a mesa structure including semiconductor epitaxial layers and characterized by inwardly tilted mesa sidewalls, a high-refractive index material region (e.g., with a refractive index greater than about 1.75, such as equal to or greater than a refractive index of the semiconductor epitaxial layers) surrounding the semiconductor epitaxial layers of the mesa structure and including outwardly tilted sidewalls, and a reflective layer on the outwardly tilted sidewalls of the high-refractive index material region. In one example, each LED of the array of LEDs also include a passivation layer on the inwardly tilted mesa sidewalls of the mesa structure.

Microdisplay architecture with light extraction efficiency enhancement

A light emitting diode includes an n-type semiconductor layer including a pit structure formed therein, active layers grown only on sidewalls of the pit structure and configured to emit light, and a p-type semiconductor layer on the active layers and at least partially in the pit structure. In one embodiment, the pit structure is characterized by a shape of an inverted pyramid. The pit structure is formed in the n-type semiconductor layer by, for example, etching the n-type semiconductor layer using an etch mask layer having apertures with slanted sidewalls, or growing the n-type semiconductor layer on a substrate through a mask layer having an array of apertures.

Semipolar micro-LED

A light source includes an array of micro-light emitting diodes (micro-LEDs), an array of micro-lenses, and a bonding layer bonding the array of micro-lenses to the array of micro-LEDs. Each micro-LED of the array of micro-LEDs includes a first mesa structure formed in a plurality of semiconductor layers. The array of micro-lenses is bonded to a first semiconductor layer of the plurality of semiconductor layers by the bonding layer. The first semiconductor layer includes an array of second mesa structures formed therein. The first mesa structure and the second mesa structure are on opposite sides of the plurality of semiconductor layers. Each second mesa structure of the array of second mesa structures is aligned with a respective micro-lens of the array of micro-lenses and the first mesa structure of a respective micro-LED of the array of micro-LEDs.

Micro-LED light extraction efficiency enhancement

A light emitting diode (LED) device includes a substrate and a plurality of mesa structures. Each mesa structure includes a layer of a first semiconductor material, a porous layer of the first semiconductor material on the layer of the first semiconductor material, and a layer of a second semiconductor material on the porous layer. The porous layer is characterized by an areal porosity &#x2265;15%. The second semiconductor material is characterized by a lattice constant greater than a lattice constant of the first semiconductor material. Each mesa structure also includes an active region on the layer of the second semiconductor material and configured to emit red light, a p-contact layer on the active region, a dielectric layer on sidewalls of the p-contact layer and the active region, and an n-contact layer in physical contact with at least a portion of sidewalls of the layer of the second semiconductor material.

Growing community of inventors

Plymouth, United Kingdom

Wei Sin Tan