Taiwan Semiconductor Manufacturing Comp. Ltd.

Wei-Sho Hung

Ho-Chun Liou

Hung-Sen Wang

Kuo-Ching Chang

Shih-Chi Yang

Chih-Hsien Lin

Hsiang-Tai Lu

An integrated circuit and a method of fabricating the integrated circuit are provided. In various embodiments, the integrated circuit includes a substrate and a polysilicon resistor. The polysilicon resistor is disposed on the substrate. The polysilicon resistor has at least one positive TCR portion and at least one negative TCR portion. The positive TCR portion is adjacent to the negative TCR portion, and the positive TCR portion is in direct contact with the negative TCR portion.

Integrated circuit and method of fabricating the same

An interconnection component includes a substrate, and an active through-substrate via (TSV) penetrating through the substrate. Active metal connections are formed over the substrate and electrically connected to the active TSV. At least one of a dummy pad and a dummy solder bump are formed at surfaces of the interconnection component. The dummy pad is over the substrate and electrically connected to the active TSV and the active metal connections. The dummy solder bump is under the substrate and electrically connected to the active metal connections. The dummy pad and the dummy solder bump are open ended.

Interposer testing using dummy connections

Growing community of inventors

Beigang, Taiwan

Wei-Sho Hung