Intel Corporation

Bridgelux Incorporated

Lumentum Operations LLC

Finisar Corporation

Apple Inc.

Applied Materials, Inc.

Vivalnk, Inc.

Wei Shi

Daoqiang Lu

Qing A Zhou

Jiangqi He

Lijun Zhu

Xiang Yin Zeng

Siu Kwan Cheung

Alex Shaikevitch

Huanlin Zhu

Yiqun Bai

Hao Huang

Raman Srinivasan

Liang-Yuh Chen

Fay Hua

John Michael Miller

Carl L Deppisch

Ted Tie Guo

Adar Magen

Michael Solomensky

Idan Mizrahi

Tom Fitzgerald

Kevin Wang

Shanquan Bao

Jianqqi He

Mike Gasparek

Ed Murphy

In some implementations, an optical assembly includes a substrate that includes a thermally conductive core, an IC driver chip that is disposed on a first surface of the substrate, and a VCSEL device that includes an electrically insulated surface that is disposed on the thermally conductive core of the substrate within a cavity formed in the second surface of the substrate. The VCSEL device includes a cathode contact disposed on a surface of the VCSEL device and an anode contact disposed on the surface of the VCSEL device. The VCSEL device includes a plurality of emitters and a microlens component that is disposed over the plurality of emitters on the surface of the VCSEL device.

Optical assembly with a microlens component and contacts on a same surface of a vertical cavity surface emitting laser device

An optical device may include a substrate including a conductive core, a first layer stack on a first surface of the conductive core, a conductor-filled trench extending through the first layer stack to the conductive core such that the conductor-filled trench is on the first surface of the conductive core, and a second layer stack on a second surface of the conductive core. The optical device may include a vertical-cavity surface-emitting laser (VCSEL) chip above the conductor-filled trench. The VCSEL chip may include an array of VCSELs. A size of the conductor-filled trench may match a size of the VCSEL chip, match a size of an emission region of the array of VCSELs, or be greater than the size of the emission region of the array of VCSELs and less than the size of the VCSEL chip.

Optical device including a substrate with a conductor-filled trench on a conductive core

In some implementations, a housing for an electro-optical device comprises a molded dielectric structural component, an electromagnetic interference (EMI) shield, and a plurality of conductive traces. The molded dielectric structural component may be configured to separate the EMI shield and the plurality of conductive traces.

Package for a time of flight device

A substrate may include a thermally conductive metal core having a top side and a bottom side, a first dielectric coating on the top side of the metal core, a second dielectric coating on the bottom side of the metal core, a first metal circuit layer formed above the first dielectric coating, and a second metal circuit layer formed under the second dielectric coating. In some implementations, the first dielectric coating and the second dielectric coating have thicknesses below sixty micrometers and respective thermal resistances under fifteen degrees Celsius per watt. In some implementations, one or more electrical currents flowing vertically across a dielectric coating have a low parasitic inductance based on the thickness of the dielectric coating, and the metal core may dissipate heat flowing across the dielectric coating and into the metal core.

Packaging substrate with low thermal resistance and low parasitic inductance

An embedded ceramic substrate package includes a ceramic substrate embedded in one or more layers. The one or more layers include at least a bulk molding compound (BMC) and a redistribution layer (RDL). At least a portion of the one or more layers includes electrical signal trace routing. The embedded ceramic substrate package is attached to an image sensor that is configured to capture light projected onto a surface of the image sensor.

Camera module including embedded ceramic substrate package

Disclosed is a three-dimensional image sensing module with a low z-height, and a process for forming the same. The three-dimensional image sensing module may include two or more cameras to capture image data, where each camera includes a lens holder having at least one optical camera lens. Furthermore, the three-dimensional image sensing module may also include a spacer attached to a top side of the lens holders of the two or more cameras that provides dimensional stability for the relative positioning of the two or more cameras with respect to one another.

Three-dimensional image sensing module with a low z-height

A wearable thermometer patch includes a substrate and a temperature probe unit mounted in the substrate and configured to measure temperature of a user's skin. The temperature probe unit includes a force sensor configured to measure contact force between the temperature probe unit and the user' skin, a plate, a first temperature sensor attached to a lower surface of the plate, and a second temperature sensor attached to an upper surface of the plate.

Wearable thermometer patch for correct measurement of human skin temperature

In an example embodiment, a circuit interconnect includes a first printed circuit board (PCB), a second PCB, a spacer, and an electrically conductive solder joint. The first PCB includes a first electrically conductive pad. The second PCB includes a second electrically conductive pad. The spacer is configured to position the first PCB relative to the second PCB such that a space remains between the first PCB and the second PCB after the first electrically conductive pad and the second electrically conductive pad are conductively connected in a soldering process. The electrically conductive solder joint conductively connects the first electrically conductive pad and the second electrically conductive pad.

Rigid-flexible circuit interconnects

A multi-element lens includes a first assembly having first and second optical elements supported respectively on a top and a bottom of a first glass substrate. A second assembly has third and fourth optical elements supported on a top and bottom of a second glass substrate. The first and second assemblies are bonded together and diced to form multiple multi-element lenses.

Stacked wafer lens and camera

Methods of forming 3D camera devices and structures formed thereby are described. An embodiment includes a first optics module and a second optics module disposed on a board, wherein a first sensor die is coupled to the first optics module and a second sensor die is coupled to the second optics module. The first and second sensor die are directly coupled to the board, and a flexible conductive connector is coupled to both the first and second optics modules.

Methods of forming integrated package structures with low Z height 3D camera

Aspects of the present disclosure include an optoelectronic assembly with a housing that defines a cavity and includes a first component and a glass component disposed on an opposite side of the cavity from the first component. The glass component may include a first surface and a second surface and a lens located on the first surface. An optical transmitter and/or an optical receiver may be mechanically coupled to the first component within the cavity and oriented to emit optical signals through the glass component and the lens. Conductive traces may be located on the second surface of the glass component and electrically coupled to the optical transmitter and/or the optical receiver. An electronic component may be coupled to at least one of the conductive traces.

Optoelectronic assembly for signal conversion

A substrate for an LED assembly can have a plurality of cups formed therein. At least one cup can be formed within another cup. The cups can be co-axial with respect to one another, for example. A machined surface of the substrate can enhance reflectivity of the LED assembly. A transparent and/or non-global solder mask can enhance reflectivity of the LED assembly. A transparent ring can enhance reflectivity of the LED assembly. By enhancing reflectivity of the LED assembly, the brightness of the LED assembly can be increased. Brighter LED assemblies can be used in applications such as flashlights, displays, and general illumination.

Multi-cup LED assembly

Phosphor layer arrangement for use with light emitting diodes. In an aspect, a light emitting diode apparatus is provided that includes a least one light emitting diode, an encapsulation covering the at least one light emitting diode, a lens having a phosphor layer formed upon a bottom surface, the lens positioned to cover at least part of the encapsulation, and an air gap between the phosphor layer and the encapsulation. In an aspect, a light emitting diode lamp is provided that includes a package, a least one light emitting diode, an encapsulation covering the at least one light emitting diode, a lens having a phosphor layer formed upon a bottom surface, wherein the lens is positioned to cover at least part of the encapsulation, and an air gap between the phosphor layer and the encapsulation.

Phosphor layer arrangement for use with light emitting diodes

Disclosed are embodiments of a multi-chip assembly including optically coupled die. The multi-chip assembly may include two opposing substrates, and a number of die are mounted on each of the substrates. At least one die on one of the substrates is in optical communication with at least one opposing die on the other substrate. Other embodiments are described and claimed.

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San Jose, CA, United States of America

Wei Shi