Intel Corporation

Inventec Appliances Corporation

Inventec Appliances (pudong) Corporation

Inventec Appliances (shanghai) Co., Ltd.

Wei Shen

Kaladhar Radhakrishnan

Embodiments disclosed herein include microelectronic boards and electronic systems. In an embodiment, a microelectronic board comprises aboard substrate, where the board substrate has a first thickness between a first surface and a second surface opposite from the first surface. In an embodiment, a recess is formed into the first surface of the board substrate, where the recess comprises a third surface between the first surface and the second surface. In an embodiment, the board substrate has a second thickness between the third surface and the second surface. In an embodiment, the microelectronic board further comprises a voltage regulator (VR) module attached to the third surface.

Backside recess in motherboard with thermally conductive mold

A noise cancellation processing method, device and apparatus are provided. The noise cancellation processing method includes: collecting first voice data in a surrounding environment by using a noise-cancelling earphone in response to detecting that the noise-cancelling earphone is in a wearing state and a noise cancellation mode is enabled; extracting to-be-recognized voiceprint feature information according to the first voice data; identifying similarities between registered voiceprint feature information stored in a registered voiceprint database and the to-be-recognized voiceprint feature information entry by entry; and in response to at least one of the similarities being greater than a first preset threshold, performing a preset action in the noise-cancelling earphone.

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Shanghai, China

Wei Shen