Ii-vi Delaware, Inc.

Wei Peng Nian

Ting Shi

Wei Zhang

Hui Calvin Yang

Feng Wang

Tao Sun

Shao Jun Yu

Hui Juan Yan

Qing Qian

Bing Qiu

The present disclosure generally relates to printed circuit boards or printed circuit board assemblies for fiber optic communications. In one non-limiting embodiment, a method of assembling an optoelectronic assembly includes providing a printed circuit board with a first metal coating and an optical component with a second metal coating. The method further includes positioning the optical component relative to the printed circuit board with at least some portion of the first metal coating aligned with or adjacent to at least some portion of the second metal coating, and applying solder between the first metal coating and the second metal coating to couple the optical component and the printed circuit board.

Surface mounting techniques for fiber optics printed circuit board assemblies using metal coatings and tabs

In one example embodiment, a PCBA, an optoelectronic module, an electrical coupling, and/or a high speed interconnect may include a first contact pad, a second contact pad adjacent to and spaced apart from the first contact pad, a first wire coupled to the first contact pad via a first ball bump, and a second wire coupled to the second contact pad via a double ball bump.

Electrical coupling assemblies and methods for optoelectronic modules

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Shanghai, China

Wei Peng Nian