Taiwan Semiconductor Manufacturing Comp. Ltd.

Other

Analog Integrations Corporation

Macronix International Co., Ltd.

National Yang Ming Chiao Tung University

National Sun Yat-sen University of Kaohsiung

Airoha Technology Corporation

Asustek Computer Inc.

National Health Research Institutes

Chipmos Technologies Inc.

Unlimiter Mfa Co., Ltd.

National Taipei University of Education

Lovetex Industrial Corp.

Wei-Ming Chen

Shu-Ming Chang

Shang-Yun Hou

Hsien-Pin Hu

Chia-Lun Tsai

Chi-Hsi Wu

Ying-Nan Wen

Wen-Hsin Wei

Chen-Hua Douglas Yu

Sung-Hui Huang

Yuan-Ching Peng

Kuo-Ping Yang

Kuo-Ching Hsu

Cheng-Hsien Hsieh

Chia-Ming Cheng

Wen-Cheng Chien

Ching-Yu Ni

Der-Min Tsay

Wen Hsin Wei

Baw-Ching Perng

Kuan-Li Chao

Chung-Yu Wu

Shyue-Shyh Lin

Po-Han Lee

Jing-Chyi Wang

Lien-Che Ho

Kun-Lung Hsu

Ming-Dou Ker

Chien-Hung Liu

Shou-Zen Chang

Kuo-Chiang Ting

Neo Bob Chih-Yung Young

Hsin-Li Cheng

Yu-Ting Cheng

Mo-Chiun Yu

Tu-Hao Yu

Ting-Yu Yeh

Jian-Ying Li

Bai-Yao Lou

Chih-Long Chang

Kuan-Jung Chen

Hsien Yu Tseng

Po-Jui Wu

Chin-Shan Hou

Kuo-Wei Kao

Chi-Chia Huang

Ho-Hsin Liao

Guan-shyong Hwang

Ji-Kuang Tan

Wei-Lin Chang

I-Ting Lee

Wei-Ren Lan

Chun-Chieh Chen

Hsien Yu-Tseng

Kai-Yuan Hsiao

Tien-Hao Huang

Chen-Wei Fan

Teng-Liang Ng

Mao-I Ting

Shih-Feng Tsai

Nan-Chun Lin

Jing-Wei Li

Tsung-Chun Lin

Chih-Ming Cheng

Kun-Yu Liu

Ju-Huei Tsai

Chang-Yu Wang

Yun-Ji Hsieh

Yun-Jui Hsieh

Szu-Ming Chiang

Chi-Hung Tsai

Yu-Fen Liu

Chloe Hsin-yi Chen

David Hsu-Wei Lwu

Chia-Jung Lee

Shyue-Shyn Lin

Chen-Lung Chou

Kuang-Hsin Liu

Chia-Nan Lee

Shu-Ling Ku

Kung-Yi Chen

Jyun-Ting Chen

Yuan-Shin Lin

Jung-Chen Chung

Yi-Chiang Sun

Yu-Ling Lu

Chi-Jui Lien

Chien-Ju Li

A conjugate cam reducer includes input and output units disposed at two opposite sides of a transmission unit along an output axis. The transmission unit includes input-side and output-side cam discs having first and second grooved surfaces. The input unit includes an input disc having a plurality of first receiving grooves registered with the first grooved surfaces to receive input rollers, and an eccentric shaft rotated to drive rotation of the transmission unit in an eccentric cam motion. The output unit includes an output disc having an inner peripheral wall which engages with the output-side cam disc, and a plurality of second receiving grooves which are registered with the second grooves to receive output rollers. An outer diameter of each first toothed surface and an outer diameter of each second toothed surface is gradually increased along a direction parallel to the output axis.

Conjugate cam reducer

The present disclosure provides a method for evaluating a heat sensitive structure. The method includes identifying a heat sensitive structure in an integrated circuit design layout and identifying a heat generating structure in the integrated circuit design layout. The method also includes calculating an operating temperature of the heat generating structure by taking a practical current distribution into consideration. The method also includes calculating an anticipated temperature increase for the heat sensitive structure induced by thermal coupling of the heat generating structure at the operating temperature.

Electromigration evaluation methodology with consideration of current distribution

A true wireless multichannel-speakers device and a multiple sound-source voicing method thereof are disclosed. The true wireless multichannel-speakers device includes a first and a second sounder. The first and the second sounders respectively include a first and a second sound effect generators, a first and a second sound effect value providers, and a first and a second speakers. The first sound effect value provider provides a first sound effect control value set to the first sound effect generator to generate a first sound effect output signal so that the first speaker outputs the first sound effect output signal. The second sound effect value provider provides a second sound effect control value set to the second sound effect generator to generate a second sound effect output signal so that the second speaker outputs the second sound effect output signal.

True wireless multichannel-speakers device and multiple sound source voicing method thereof

The present disclosure provides a method and an apparatus for testing a semiconductor device. The method includes providing an active area in an integrated circuit design layout; grouping the active area into a first region and a second region; calculating a first self-heating temperature of the first region of the active area; calculating a second self-heating temperature of the second region of the active area; and determining an Electromigration (EM) evaluation based on the first self-heating temperature and the second self-heating temperature.

Method and apparatus for electromigration evaluation

A cam transmission mechanism includes a rotary disk, a camshaft, contact members and a housing. The rotary disk has a periphery formed with equidistant projections, any two adjacent ones of which define an accommodating recess. The camshaft includes a shaft rod and a cam body that has at least one groove communicated with some of the recesses of the rotary disk. The groove and the recesses cooperate to form a plurality of confining spaces, within which the contact members are accommodated freely rollably for rotation transfer from the camshaft to the rotary disk. The housing is connected to the rotary disk for confining the contact members in the confining spaces, respectively.

Cam transmission mechanism with ball followers

A temperature control system, adapted to a central processing unit powered by a power supply module of an electronic device, is provided. The temperature control system includes a setting module, a first temperature detecting module, a second temperature detecting module, and a power adjusting module. The setting module is configured to set a target temperature of the CPU and a target temperature of the power supply module. The first temperature detecting module is configured to obtain a detected temperature of the CPU. The second temperature detecting module is electrically connected to the power supply module, to obtain a detected temperature of the power supply module. The power adjusting module is configured to adjust a control parameter of the CPU or the power supply module based on a first temperature difference between the target temperature of the CPU and the detected temperature of the CPU or a second temperature difference between the target temperature of the power supply module and the detected temperature of the power supply module.

Temperature control system for central processing unit and temperature control method thereof

A method for adjusting playing sound in a sound playing system is disclosed. The sound playing system includes a camera module, a facial analysis module, a sound inputting module, a sound adjustment module, and a speaker. The method includes: obtaining an image of a face of each one of a plurality of people through the camera module; analyzing the image to estimate the age of each one of the plurality of people through the facial analysis module, and obtaining a target age according to the age of each person; obtaining a playing sound through the sound inputting module; adjusting the playing sound according to the target age through the sound adjustment module to obtain an output sound; and playing the output sound through the speaker.

Playing sound adjustment method and sound playing system

An automatic nut tapping equipment is provided. The automatic nut tapping equipment includes a tap rotating mechanism, a nut clamping mechanism, an axial transmission mechanism, and a nut placing slot. The tap rotating mechanism includes a tap rotary motor and a tap, wherein the tap is driven by the tap rotary motor. The nut clamping mechanism includes a clamping assembly and a sliding rail, wherein the clamping assembly is disposed on the sliding rail and is configured for clamping a to-be-tapped nut to restrict the to-be-tapped nut from rotating. The axial transmission mechanism controls the clamping assembly to axially translate one pitch in response to the tap rotating one revolution, such that a forward nut-tapping motion and a backward nut-retracting motion are performed by the nut clamping mechanism. The nut placing slot is configured to arrange and control the dropping of another to-be-tapped nut.

Automatic nut tapping equipment

A semiconductor device, and a method of forming the device, are provided. The semiconductor device includes a first die having a first plurality of contact pads and a second die having a second plurality of contact pads. A substrate is bonded to a first contact pad of the first plurality of contact pads and a first contact pad of the second plurality of contact pads in a face-to-face orientation with the first die and the second die. A first through via extends through the substrate. Molding material is interposed between the first die, the second die and the substrate, the molding material extending along sidewalls of the first die, the second die, and the substrate. A second through via is positioned over a second contact pad of the first plurality of contact pads, the second through via extending through the molding material.

Stacked integrated circuit structure and method of forming

A wireless charging device includes a wireless charging transmitter transmitting a charging signal to a signal gain module to generate at least one gain signal. The signal gain module includes an insulation substrate with an upper surface thereof provided with a first conductive wire. The first conductive wire makes at least one turns arranged along the inner edge of the insulation substrate. The lower surface of the insulation substrate is provided with a second conductive wire whose position corresponds to the position of the first conductive wire. A connecting element is arranged between the first conductive wire and the second conductive wire, such that the first conductive wire is electrically connected to the second conductive wire through the connecting element. The present invention provides a charging signal with high intensity to avoid the low charging efficiency caused by deflection and too long a distance.

Wireless charging device

A three-dimensional chip stack includes a first chip bonded to a second chip to form an electrical interconnection therebetween. The bonded interconnection includes a first conductive pillar overlying a first substrate of the first chip, a second conductive pillar overlying a second substrate of the second chip, and a joint structure between the first conductive pillar and the second conductive pillar. The joint structure includes a first IMC region adjacent to the first conductive pillar, a second IMC region adjacent to the second conductive pillar, and a metallization layer between the first IMC region and the second IMC region.

Three-dimensional chip stack and method of forming the same

Chip on wafer on substrate structures and methods of forming are provided. The method includes attaching a first die and a second die to an interposer. The method also includes attaching a first substrate to a first surface of the first die and a first surface of the second die. The first substrate includes silicon. The first surface of the first side is opposite to the surface of the first die that is attached to the interposer, and the first surface of the second die is opposite to the surface of the second die that is attached to the interposer. The method includes bonding the interposer to a second substrate.

COWOS structures and method of forming the same

Formation methods of a chip package are provided. The method includes bonding a first chip structure and a second chip structure over a substrate. The method also includes forming a release film to cover top surfaces of the first chip structure and the second chip structure. The method further includes forming a package layer to surround the first chip structure and the second chip structure after the formation of the release film. In addition, the method includes removing the release film such that the top surface of the first chip structure, the top surface of the second chip structure, and a top surface of the package layer are exposed.

Formation method of chip package

Growing community of inventors

Taipei, Taiwan

Wei-Ming Chen