Powertech Technology Inc.

Wei-Min Chen

Wen-Jeng Fan

Che-Min Chu

Disclosed is a semiconductor package utilizing a tape to reinforce fixing of leads to a die pad having a through hole. The package primarily comprises a leadframe having the plurality of leads and the die pad, a tape, at least a chip, and an encapsulant. The die pad. The tape is attached beneath the leadframe adjacent to the inner fingers of the leads to fix the leads and the die pad for wire-bonding. Additionally, the tape does not completely cover the through hole. The chip is disposed on the leads and the die pad and electrically connected to the inner fingers. The encapsulant encapsulates the die pad, the tape and the chip with the leads being insulatedly bonded where the encapsulant further completely fills into the through hole through its opening without completely covered by the tape.

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Hsinchu, Taiwan

Wei-Min Chen