Sae Magnetics (h.k.) Limited

Hong Kong Applied Science and Technology Research Institute Company, Limited

Wei Ma

Xiaoming Yu

Francis Guillen Gamboa

Dennis Tak Kit Tong

Wai Hung

Chang Hwa Chung

MingGao Yao

Vincent Wai Hung

Xunqing Shi

Bin Xie

Ho Yin Chan

Francis Chee-Shuen Lee

Minggao Yao

Xunqing Shu

Yiru Xie

An optical subassembly includes: a TSV submount layer carrying an active optical component and a sandwich cap bonded to the TSV submount layer. The sandwich cap includes a bottom spacer layer disposed above the TSV submount layer, a glass layer above the bottom spacer layer, and an upper spacer layer above the glass layer. A cavity is defined in the bottom spacer layer and configured for accommodating the active optical component. At least one first lens is formed on the glass layer and is opposite to the active optical component. An alignment feature is formed in the upper spacer layer.

Wafer level packaged optical subassembly and transceiver module having same

A power monitoring device includes: a silicon support layer being attached to a PCB board; a glass layer disposed above the silicon support layer; at least one sensing element disposed on the glass layer; and at least one metal pad disposed on the glass layer. The sensing element is suspended over a laser element that is attached to the PCB board and configured for sensing light directed thereto that is emitted by the laser element. A cavity is defined in the silicon support layer and configured for accommodating the laser element. A transmitter that includes the power monitoring device is also provided.

Power monitoring device and transmitter having same

There is described a method of forming a through-silicon-via to form an interconnect between two stacked semiconductor components using pulsed laser energy. A hole is formed in each component, and each hole is filled with a plug formed of a first metal. One component is then stacked on another component such that the holes are in alignment, and a pulse of laser energy is applied to form a bond between the metal plugs.

Pulse-laser bonding method for through-silicon-via based stacking of electronic components

A biaxial micro-electromechanical (MEMS) device is disclosed. The device includes a gimbal rotatable about a gimbal axis of rotation. A pair of gimbal torsion bars connects the gimbal to a support along the gimbal rotation axis. A mirror plate is rotatable about a mirror axis of rotation, the mirror plate rotation axis being substantially perpendicular to the gimbal rotation axis. A pair of mirror plate torsion bars connects the mirror plate to the gimbal along the mirror plate axis of rotation. One or more gimbal moment-of-inertia-altering blocks are positioned on a surface of the mirror plate away from the gimbal axis of rotation. Additionally, one or more mirror plate moment-of-inertia-altering blocks are positioned on a surface of the mirror plate away from the mirror plate rotation axis such that the distance from the mirror plate axis determines a resonant frequency of the biaxial MEMS device.

Biaxial scanning mirror having resonant frequency adjustment

There is described a hybrid bonding method for through-silicon-via based wafer stacking. Patterned adhesive layers are provided to join together adjacent wafers in the stack, while solder bonding is used to electrically connect the vias. The adhesive layers are patterned to enable outgassing and to provide stress relief.

Bonding method for through-silicon-via based 3D wafer stacking

A rotational micro-actuator () used in hard disk driver is disclosed. It comprises a frame () approximately in the shape of letter 'S' and PZT pieces () attached to said frame (), wherein said frame () is formed with a central coupling portion () by which the micro-actuator () is coupled to a suspension tongue (), and two pieces of said PZT () are arranged in central symmetry manner about said central coupling portion () such that said micro-actuator () can rotate about said central coupling portion () in response to the driving signals applied to said PZT pieces (), thus cause the displacement of the head element secured to the micro-actuator () so as to achieve the fine positioning of the head element. With above configuration, the micro-actuator of this invention will not cause the resonance of the suspension base plate during operation. Thereby the servo bandwidth of the hard disk driver is expanded.

HGA rotational micro-actuator including an s-shaped frame and method of making thereof

A micro-actuator for a head gimbal assembly includes a frame, a first set of bonding pads provided to one end of the frame, a second set of bonding pads provided to an opposing end of the frame, and a trace integrated to the frame. The trace interconnects the first set of bonding pads and the second set of bonding pads.

Growing community of inventors

Hong Kong, China

Wei Ma