Lite-on Technology Corporation

Lite-on Opto Technology (changzhou) Co., Ltd.

Wei-Lun Tsai

Chih-Yuan Chen

Tien-Yu Lee

Chien-Tung Huang

Wei-Hsun Hsu

Wei-Chien Hung

A chip-scale LED package structure includes a white light emitting unit for emitting a white light, a red flip-chip LED for emitting a red light, a green flip-chip LED for emitting a green light, a blue flip-chip LED for emitting a blue light, and an encapsulation layer. The encapsulation includes an encapsulation resin and a plurality of refractive particles distributed in the encapsulation resin. The encapsulation layer encapsulates the white light emitting unit, the red flip-chip LED, the green flip-chip LED, and the blue flip-chip LED. Moreover, electrodes of the white light emitting unit, electrodes of the red flip-chip LED, electrodes of the green flip-chip LED, and electrodes of the blue flip-chip LED are exposed from the encapsulation layer.

Growing community of inventors

Taipei, Taiwan

Wei-Lun Tsai