Applied Materials, Inc.

Wei Lu

Boguslaw A Swedek

Fred Conrad Redeker

Wen-Chiang Tu

Hassan G Iravani

Zhihong Wang

William H McClintock

Zhefu Wang

A substrate for use in fabrication of an integrated circuit has a layer with a plurality of conductive interconnects. The substrate includes a semiconductor body, a dielectric layer disposed over the semiconductor body, a plurality of conductive lines of a conductive material disposed in first trenches in the dielectric layer to provide the conductive interconnects, and a closed conductive loop structure of the conductive material disposed in second trenches in the dielectric layer. The closed conductive loop is not electrically connected to any of the conductive lines.

Substrate features for inductive monitoring of conductive trench depth

Growing community of inventors

Westerna, Australia

Wei Lu