Intel Corporation

Wei Liao

Jun Lu

Guoliang Ying

Guangying Zhang

Fangbo Zhu

Wesley Brook Morgan

Liguang Du

Juan Antonio Orozco Ramirez

Song Kok Hang

Xinglong Xu

Systems, apparatuses, processes, and techniques are provided which are related to a vapor chamber () having a first side and a second side opposite the first side, where the first side is to thermally couple to a heat sink () and the second side to thermally couple to a heat source. The vapor chamber () may include a compressible mechanism disposed within the vapor chamber () coupled with the first side and the second side where the second side, when coupled to the heat source, is to deform at least partially to match a shape of the heat source. The compressible mechanism within the vapor chamber () may moderate the deformation of the second side.

Moderated deformation of a vapor chamber to match a shape of a heat source

Herein described are apparatuses and systems for facilitating alignment of computer component connectors. A package protector may include a body to at least partially surround an integrated circuit package of a circuit card when the package protector is mounted to the circuit card. The package protector may further include a guide pin component that extends from a side of the body, wherein the guide pin component is to be located adjacent to a header of the circuit card when the package protector is mounted to the circuit card, wherein a connector uses the guide pin component to align with the header via a guide pin.

Package protector with integrated guide pin

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Shanghai, China

Wei Liao