Avago Technologies General IP (singapore) Pte. Ltd.

Avago Technologies General IP Pte, Ltd.

Wei Liam Loo

Kheng Leng Tan

Keat Chuan Ng

Chiau Jin Lee

Kee Yean Ng

Hui Peng Koay

Janet Bee Yin Chua

Aizar Abdul Karim Norfidathul

Alzar Abdul Karim Norfidathul

A plurality of different frequency absorbing materials are placed between an LED and a surface so as to generate a non-monochromatic colors. In one embodiment, a light device is arranged with light sources, each of which emit light of a different color, and by surrounding the different colored light sources with a color changing media, each of which absorb light of different colors and by allowing the light sources to be individually calibrated as to power level, a variety of colors can be achieved.

LED with light absorbing encapsulant and related methodology

A packaged circuit and method for packaging an integrated circuit are disclosed. The packaged circuit has a lead frame, an integrated circuit chip, and an encapsulating layer. The lead frame has first and second sections, the first section including a lateral portion, a chip mounting area and a first extension. The integrated circuit chip is mounted in the chip mounting area and is in thermal contact with the chip mounting area. The encapsulating layer has top, bottom, and first and second side surfaces. The first extension is bent to provide a first heat path from the chip mounting area to the bottom surface. The heat path connects the heat chip mounting area to the bottom surface without passing through the first and second side surfaces and provides a heat path that has less thermal resistance than the heat path through either the lateral portion or the second section.

Light emitting diode package with direct leadframe heat dissipation

Light emitting diode

Growing community of inventors

Penang, Malaysia

Wei Liam Loo