Fujifilm Sonosite, Inc.

General Electric Company

Sonosite, Inc.

Wei Li

N Chris Chaggares

Gregg W Frey

Paul Thurman Dunham

Chak-Yoon Aw

Bin Wei

Thomas James Batzinger

Robert S Gilmore

James Norman Barshinger

Richard Eugene Klaassen

Michael Scott Lamphere

Keith David Williams

Simon Hsu

Bruno Hans Haider

John Broddus Deaton, Jr

William Thomas Hatfield

Edward James Nieters

Patrick Joseph Howard

Michael John Danyluk

Carl Lawrence Chalek

Allan Coleman

Robert John McElligott

David Charles Copley

David Paul Lappas

Rick Hippe

David Charles Franklin

Robert Snee Gilmore

Eugene Klaassen Richard

Robert John Mceilligott

A method and apparatus are disclosed herein for a thermally conductive layer for transducer face temperature reduction in an ultrasound transducer assembly. In one embodiment, the ultrasound transducer assembly comprises: a transducer layer configured to emit ultrasound energy; one or more matching layers overlaying the transducer layer; a thermally conductive layer overlaying the one or more matching layers; and a lens overlaying the thermally conductive layer.

Thermal conductive layer for transducer face temperature reduction

Ultrasound transducer assemblies and associated systems and method are disclosed herein. In one embodiment, an ultrasound transducer assembly includes at least one matching layer overlies a transducer layer. A plurality of kerfs extends at least into the matching layer. In some aspects, the kerfs are at least partially filled with a filler material that includes microballoons and/or microspheres.

Ultrasound transducer assembly

A PMUT ultrasound transducer includes a number of PMUT transmitting elements in a membrane layer. Behind each PMUT transmitting element is a cavity in the membrane layer. The cavities are partially or completely filled with a damping material to reduce ringing of the PMUT transmitting elements. Suitable damping materials include polymers, e.g., soft epoxies, benzocyclobutene or polyimide that are dispersed into the cavities or a phase changing material such as Parylene that precipitates out of a gas phase as a polymer when cured.

PMUT ultrasound transducer with damping layer

Matching layers configured for use with ultrasound transducers are disclosed herein. In one embodiment, a transducer stack can include a capacitive micromachined ultrasound transducer (CMUT), an acoustic lens, and a matching layer therebetween. The matching layer can be made from a compliant material (e.g. an elastomer and/or an liquid) and configured for use with CMUTs. The matching layer can include a bottom surface overlying a top surface of the transducer and a top surface underlying a bottom surface of the lens.

Acoustic lens for micromachined ultrasound transducers

Systems and methods which improve the directivity of a transducer array by reducing electrical cross-talk between conductors connected to individual transducer array elements through the use of a plurality of interconnect circuits are shown. A plurality of signal transmission path circuits, such as circuit boards, flexible printed circuits, etc., are used to provide electrical power to and receive signals from transducer elements of a transducer array. Embodiments couple transducer elements to conductive traces of the signal transmission path circuits in a manner such that adjacent transducer elements are not connected to conductive traces on the same signal transmission path circuit. In some embodiments, a plurality of signal transmission path circuits are offset such that two identical signal transmission path circuits can be used to provide connectivity to array transducer elements using more widely spaced conductive traces, thus reducing electrical cross-talk effects.

Array interconnect for improved directivity

The present disclosure provides for the application of a two-dimensional ultrasonic phased array (), formed of a plurality of transducers () arranged in a rectilinear pattern, for material and volumetric component testing. The two-dimensional array enables electronic adjustment of the focal properties and size of the aperture in both the azimuthal and elevational directions such that uniform and/or specified sound field characteristics can be obtained at any or all locations in the component being tested.

Two dimensional phased arrays for volumetric ultrasonic inspection and methods of use

An electrochemical machining tool assembly includes first and second tools that are spaced apart from one another so that a workpiece can be located therebetween. The assembly also includes a first ultrasonic transducer mounted in the first tool and a second ultrasonic transducer mounted in the second tool. The electrochemical machining process is monitored by generating ultrasonic waves with the first and second ultrasonic transducers, and then detecting the arrival times, at the first and second ultrasonic transducers, of certain reflections of the ultrasonic waves. The detected arrival times are then used to calculate parameters such as the gap sizes between the first and second tools and a workpiece situated therebetween and the thickness of the workpiece.

Electrochemical machining tool assembly and method of monitoring electrochemical machining

A method for inspecting a component includes exciting a number of transducers forming an array to produce an ultrasonic transmission beam (beam) focused into the component. The array and the component are separated by a standoff. A number of echo signals are generated using the transducers, and the echo signals are processed in a number of channels. The processing includes both dynamical focus and providing a dynamic aperture on receive, both of which compensate for refraction of the beam at the component/standoff interface. A single-turn inspection method includes: (a) positioning the array facing the component, (b) exciting the transducers, (c) generating a number of echo signals, (d) changing the relative angular orientation of the array and the component around an axis and repeating steps (b) and (c), and (e) processing the echo signals to form at least one processed echo signal.

Phased array ultrasonic inspection method for industrial applications

An electrochemical machining process is monitored by embedding an ultrasonic sensor in an electrochemical machining tool to provide a tool assembly, placing the tool assembly in a spatial relationship with a workpiece, disposing an electrolytic fluid at least in a gap between the tool and the workpiece, connecting the tool and the workpiece to an electrical power source, generating an acoustic wave from the ultrasonic sensor to propagate through the electrolytic fluid to the workpiece and reflect back from the workpiece, and, based on the propagation and reception of the acoustic wave, calculating measurement of at least the size of the gap or the thickness of the workpiece.

Method of monitoring electrochemical machining process and tool assembly therefor

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Bothell, WA, United States of America

Wei Li