Industrial Technology Research Institute

Diodes Taiwan S.a R.l.

Wei-Kuo Han

Tao-Chih Chang

Ra-Min Tain

Kuo-Shu Kao

Yen-Ting Lin

Wen-Chih Chen

Jing-Yao Chang

Po-Kai Chiu

Tai-Jyun Yu

Chun-Kai Liu

Ming-Daw Chen

Shyi-Ching Liau

Chung-Hsiung Cheng

Chih-Kuang Yu

Ming-Ji Dai

Chun-Chuan Lin

Je-Ping Hu

Fang-Jun Leu

Chia-Yen Lee

Chin-Lung Chen

Chen-Hung Chew

Meng-Shin Kuo

A chip package including a heat-dissipating device, a first thermal interface material layer disposed on the heat-dissipating device, a patterned circuit layer disposed on the first thermal interface material layer, a chip disposed on the patterned circuit layer and electrically connected to the patterned circuit layer, and an insulating encapsulant covering the chip, the patterned circuit layer, and the first thermal interface material layer is provided. The first thermal interface material layer has a thickness between 100 &#x3bc;m and 300 &#x3bc;m. The first thermal interface material layer is located between the patterned circuit layer and the heat-dissipating device.

Chip package

A power module including a main housing, a power element, and at least one assembling component is provided. The main housing has at least one side wall and at least two ribs extending from the side wall. The power element is disposed in the main housing and is closely pressed against a heat dissipation structure by the side wall. The assembling component includes a main section and two bending sections. The main section is located between the two ribs and includes a central portion, at least one movable component, and a peripheral portion. The central portion has a fastening portion, the peripheral portion surrounds the central portion, and the movable component is connected between the central portion and the peripheral portion. The two bending sections are respectively connected to two opposite sides of the peripheral portion and are respectively embedded in the two ribs.

Power module with housing having bending sections

A chip package including a lead frame, a first chip, a heat dissipation structure, and an insulating encapsulant is provided. The lead frame includes a chip pad having a first surface and a second surface opposite to the first surface and a lead connected to the chip pad. The first chip is disposed on the first surface of the chip pad and electrically connected to the lead of the lead frame and to the outside of the insulating encapsulant via the lead. The head dissipation structure is disposed on the second surface of the chip pad and includes a thermal interface material layer attached to the second surface. The insulating encapsulant encapsulates the first chip, the heat dissipation structure, and a portion of the lead frame.

An electronic device package structure including a substrate, a first circuit layer, a second circuit layer, an electronic device and an input/output device is provided. The first circuit layer includes a first conductive portion, a second conductive portion and a first curve portion located between the first conductive portion and the second conductive portion. At least a partial thickness of the first curve portion is greater than a thickness of the first conductive portion. The electronic device disposed on the second circuit layer is electrically connected to the second conductive portion of the first circuit layer. The input/output device disposed corresponding to the first conductive portion is electrically connected to the first conductive portion of the first circuit layer.

Electronic device having a curved portion between a plurality of conductive portions on a substrate

An electronic package structure is provided. The electronic packaging structure includes a substrate, a conductive layer disposed on the substrate, an intermetallic compound disposed on the conductive layer, a stress buffering material disposed on the substrate and adjacent to the conductive layer, and an electronic device disposed on the conductive layer and the stress buffering material. The intermetallic compound is disposed between the electronic device and the conductive layer, between the electronic device and the stress buffering material, between the substrate and the stress buffering material, and between the conductive layer and the stress buffering material. A maximum thickness of the intermetallic compound disposed between the electronic device and the stress buffering material, between the substrate and the stress buffering material, and between the conductive layer and the stress buffering material is greater than the thickness of the intermetallic compound disposed between the electronic device and the conductive layer.

Electronic packaging structure

A waste heat exchanger may include an inner tube, an outer tube, a fin assembly and a plurality of heat electric modules The inner tube has a plurality of holes. Disposed inside the inner tube is a plurality of inlet channels and a plurality of outlet channels. The plurality of inlet channels and the plurality of outlet channels are disposed to correspond to each other. The plurality of inlet channels and the plurality of outlet channels are connected to the plurality of holes. A fluid flows through the plurality of inlets and the plurality of holes to get into the outlet channels. The outer tube is disposed outside the inner tube. The conductive assembly is positioned between the inner tube and the outer tube. The conductive assembly is disposed on an outside surface of the inner tube and an inside surface of the outer tube.

Waste heat exchanger

A speaker device including a transparent speaker and a light source module is provided. The transparent speaker is thin, soft, and has a low driving voltage. Light is emitted from a front side of the speaker panel, and transmitted in the same direction as the sound. Thus, the light is emitted along with the sound. The speaker device can be used as an indoor wall-painting or as a large advertisement poster for more visual effects to the viewer.

Speaker devices and methods of making the same

A flexible electret transducer assembly including an electrical backplate and a membrane made of an electret material is disclosed. A plurality of spacers is formed on a surface of the electrical backplate in a longitudinal or latitudinal direction, and the spacers are used for supporting a vibrating room of the membrane. A working area of the membrane is formed between adjacent spacers, and in each of the working area, the space between the electrical backplate and the membrane is smaller than that in a conventional electrostatic speaker. The spacers between the electrical backplate and the membrane are mass produced through a stamping process. Thereby, an accurate space between the electrical backplate and the membrane can be maintained and accordingly the audio quality can be improved. In addition, a speaker including the flexible electret transducer assembly and a method for fabricating the flexible electret transducer assembly are also disclosed.

Flexible electret transducer assembly, speaker, and method for fabricating flexible electret transducer assembly

A transmitting-type liquid crystal display projection system including a planar light source which emits planar white beam or planar R/G/B beams in succession is provided. A first polarization filter receives the planar light source and polarizes the same to be in a first polarization state. A liquid-crystal light valve receives the polarized planar light source, and converts the first polarization state to a second polarization state having a corresponding gray level. A second polarization filter receives a light output from the liquid crystal light valve to produce a second polarization light beam. A projection unit projects the second polarization light beam onto a display plane. Using the same planar light source, a polarization beam splitting (PBS) device with a refection-type liquid crystal light valve can be used to achieve the reflection-type projection system.

High efficiency liquid crystal display projection system

Lighting devices are provided. A lighting device includes a first substrate, a second substrate, a light source and a thermoelectric cooling chip set disposed between the first and second substrates. The first substrate includes a core, a first circuit layer, and a second circuit layer, wherein the first and second circuit layers are disposed on opposite sides of the core. The second substrate comprises a third circuit layer. The light source is disposed on the first substrate and electrically connected to the first circuit layer. The thermoelectric cooling chip set is electrically connected to the second and third circuit layers, to dissipate heat from the light source.

Lighting devices

A novel flexible circuit board with heat dissipation ability is provided. The flexible circuit board includes a heat sink and a heat spreader having at least one circuit substrate mounted thereon. The heat spreader has a first lower surface and a first upper surface which has a plurality of first grooves formed thereon. At least one platform is formed between two adjacent ones of the first grooves for mounting the at least one circuit substrate. The heat sink has a second lower surface and a second upper surface which has a plurality of second grooves formed thereon and is connected to the first lower surface.

Flexible circuit board with heat sink

A structure of illuminating unit includes a point-like light-emitting device, having an optical axis. An initial-stage conoid-like reflective surface has a convergent opening end and a divergent opening end. The point-like light-emitting device is located at the convergent opening end and the optical axis is toward the divergent end for emitting light. The initial-stage conoid-like reflective surface and the optical axis include an initial-stage included angle. A final-stage conoid-like reflective surface has a convergent opening end and a divergent opening end. The convergent opening end of the final-stage conoid-like reflective surface is coupled with the divergent opening end of the initial-stage conoid-like reflective surface. The final-stage conoid-like reflective surface and the optical axis include a final-stage included angle. The initial-stage included angle is larger than the final-stage included angle.

Structure of illuminating unit and structure of illuminating light source

A method of manufacturing a composite optical element, in which method a lens material of plastic is formed on a lens. The lens has a first optical surface and a second optical surface, and a lateral edge tilted at an angle relative to the perpendicular center line of the lens. The lens material is formed into a lens medium which covers only the first optical surface and a portion of the lateral edge of the lens. A tight binding is then established between the lens and the lens medium, which is formed of the lens material.

Method of manufacturing a composite optical element

A backward-leaning-movement seat leg structure is provided for attaching a seat to the floor of a vehicle or an aircraft. The backward-leaning-movement seat leg structure comprises a framework having a front beam; a rear beam parallel to the front beam; and a plurality of spreaders perpendicularly connected to the front beam and the rear beam; a rear leg being substantially arcuate and comprising a first segment pivotally connected to the rear beam and a second segment pivotally attached to the floor; an energy absorber comprising a sleeve pivotally connected to the rear leg; and an inner bar extending out from the sleeve; a rotatable arm comprising a first end fixedly connected to the front beam; and a second end pivotally connected to the inner bar of the energy absorber; a front leg comprising a third end pivotally connected to the rotatable arm between the first end and the second end; and a fourth end pivotally attached to the floor; a first fuse pin inserted through the rotatable arm and the inner bar of the energy absorber to prevent the rotatable arm from rotating relative to the inner bar; and a second fuse pin inserted through the sleeve and the inner bar to prevent the inner bar from travelling relative to the sleeve.

Growing community of inventors

Hsinchu, Taiwan

Wei-Kuo Han