Massachusetts Institute of Technology

USA As Represented by Secretary of the Navy

Rohm Co., Ltd.

Wei Kong

Jeehwan Kim

David Kurt Gaskill

Takuji Maekawa

Kyusang Lee

Noriyuki Masago

Jaewoo Shim

Kuan Qiao

Systems and methods for growth of silicon carbide over a layer comprising graphene and/or hexagonal boron nitride, and related articles, are generally described. In some embodiments, a SiC film is fabricated over a layer comprising graphene and/or hexagonal boron nitride, which in turn is disposed over a substrate. The layer and/or the substrate may be lattice-matched with the SiC film to reduce defect density in the SiC film. The fabricated SiC film may then be removed from the substrate via, for example, a stressor attached to the SiC film. In certain cases, the layer serves as a reusable platform for growing SiC films and also serves a release layer that allows fast, precise, and repeatable release at the layer surface.

Systems and methods for growth of silicon carbide over a layer comprising graphene and/or hexagonal boron nitride and related articles

Apparatus, systems, and methods for forming semiconductor materials (e.g., using nanofabrication) are generally described. In one example, a method comprises formation of a carbon buffer layer on a first substrate and a graphene layer on the carbon buffer layer, followed by removing the graphene layer so as to expose the carbon buffer layer and form a fabrication platform, and after removing the graphene layer, forming a first epitaxial layer directly on the carbon buffer layer covalently bonded to the first substrate, wherein the first epitaxial layer comprises a semiconductor. In one example, a method comprises forming an epitaxial layer directly on a carbon buffer layer that is covalently bonded to a substrate, wherein the epitaxial layer comprises a semiconductor, and wherein the carbon buffer layer is a pseudo-graphene layer.

Epitaxial growth using carbon buffer on substrate

Embodiments of this disclosure include apparatus, systems, and methods for fabricating monolayers. In one example, a method includes forming a multilayer film having a plurality of monolayers of a two-dimensional (2D) material on a growth substrate. The multilayer film has a first side proximate the growth substrate and a second side opposite the first side.

Atomic precision control of wafer-scale two-dimensional materials

A method of fabricating a multicolor light-emitting diode (LED) display includes forming a first LED layer on a first release layer comprising a first two-dimensional (2D) material disposed on a first substrate. The first LED layer is configured to emit light at a first wavelength. The method also includes transferring the first LED layer from the first release layer to a host substrate and forming a second LED layer on a second release layer comprising a second 2D material disposed on a second substrate. The second LED layer is configured to emit light at a second wavelength. The method also includes removing the second LED layer from the second release layer and disposing the second LED layer on the first LED layer.

Growing community of inventors

Cambridge, MA, United States of America

Wei Kong