Huawei Technologies Co., Limited

Dongguan China Advanced Ceramic Technology Co., Ltd.

Xi'an Baixin Chuangda Electronic Technology Co., Ltd.

Wei Kang

Jun Zhang

Zhaohui Wu

Xiaoquan Guo

Feng Wang

Yongyao Li

Jiang Zhu

Shibin Xu

Xue Feng

This application provides an electronic module and an electronic device. The electronic module includes a first component, a second component, and a plurality of terminals. The first component includes a package substrate and a chip mounted on the package substrate. The second component includes a circuit board and a mount base mounted on the circuit board. Each terminal includes a body part, and a first bent part and a solder ball that are respectively connected to two opposite ends of the body part. In each terminal, the body part passes through and is fastened to the mount base, the first bent part presses against a corresponding first solder pad on the package substrate, and the solder ball is connected to a corresponding second solder pad on the circuit board.

Electronic module and electronic device

A ceramic module for power semiconductor integrated packaging and a preparation method thereof are disclosed. The ceramic module includes a ceramic substrate and an integrated metal dam layer. By providing the integral metal dam layer on the upper surface of the ceramic substrate and forming cavities around die bonding regions, the semiconductor chip can be hermetically sealed. By providing a heat dissipation layer on the lower surface of the ceramic substrate, the heat generated by the semiconductor chip can be quickly conducted to the outside. The product has a simple production process and high product consistency.

Preparation method of a ceramic module for power semiconductor integrated packaging

Ceramic module for power semiconductor integrated packaging and preparation method thereof

Growing community of inventors

Dongguan, China

Wei Kang