Honeywell International Inc.

Wei Jun Wang

Ya Qun Liu

Linan Zhao

Zhi Zheng

Liqiang Zhang

Yue Liu

Hong Min Huang

Ling Shen

Zhe Ding

Huifeng Duan

Jeffrey Han

Hui Wang

Kai Zhang

Xuanbin Liu

Tao Pan

Wanchao Jiang

Marilyn Wang

Haigang Kang

Yuan Zheng

Liang Zeng

Bright Zhang

Neo Huang

Yanming Shen

Yunzi Jiang

David K Chen

Wei Chang

Hongsheng Zhang

A thermal interface material includes, in one exemplary embodiment, at least one polymer, at least one phase change material, at least one crosslinker, and at least one thermally conductive filler. The at least one thermally conductive includes a first plurality of particles having a particle diameter of about 1 micron or less. The at least one thermally conductive filler comprises at least 80 wt. % of the total weight of the thermal interface material. A formulation for forming a thermal interface material and an electronic component including a thermal interface material are also provided.

Thermal interface material including crosslinker and multiple fillers

A thermal interface material that is useful in transferring heat from heat generating electronic devices, such as computer chips, to heat dissipating structures, such as heat spreaders and heat sinks. The thermal interface material includes at least one silicone oil, and at least one thermally conductive filler.

Gel-type thermal interface material

A thermal interface material includes, in one exemplary embodiment, a polymer, a phase change material, a first thermally conductive filler having a first particle size, and a second thermally conductive filler having a second particle size. The first particle size is larger than the second particle size. A formulation for forming a thermal interface material and an electronic component including a thermal interface material are also provided.

High performance thermal interface materials with low thermal impedance

Poly fluorine-containing siloxane coatings having improved hydrophobic and oleophobic properties and solutions for creating such coatings are provided. In some embodiments, the coating includes a polymer having a plurality of Si&#x2014;O&#x2014;Si linkages; and at least two fluorine-containing moieties, each attached to at least one of the Si&#x2014;O&#x2014;Si linkages. Each fluorine-containing moiety independently includes a linking portion attached to a silicon of one of the Si&#x2014;O&#x2014;Si linkages, wherein the linking portion is of a formula selected from the group consisting of: &#x2014;[CH]&#x2014; where a is an integer from 1 to 10 and &#x2014;[CH]CONH[CH]&#x2014; where b and c are independently an integer from 0 to 10. Each fluorine-containing moiety also independently includes a fluorinated portion attached to the linking portion, wherein the fluorinated portion is selected from a fluorinated-alkyl group having 1-10 carbon atoms and a perfluoro-ether containing organic group.

Poly fluorine-containing siloxane coatings

Composite phase change materials, methods for manufacturing composite phase change materials, and articles of clothing including composite phase change materials for temperature regulation are provided. In one example, a composite phase change material includes a cross-linked polyethylene glycol matrix and a phase change material filler. Each of the cross-linked polyethylene glycol matrix and the phase change material filler has a phase change temperature of from about 10 to about 60&#xb0; C. Further, the composite phase change material has a latent heat of enthalpy greater than about 50 kJ/kg.

Composite phase change material (PCM), method for manufacturing a composite PCM, and article of clothing including a composite PCM

Provided is a compressible thermal interface material including a polymer, a thermally conductive filler, and a phase change material. A formulation for forming a compressible thermal interface material and an electronic component including a compressible thermal interface material are also provided.

Compressible thermal interface materials

The present invention relates to phase change materials (PCMs) which may be used with photovoltaic (PV) modules. More specifically, solid/solid PCMs having a polyolefin backbone polymer and a crystallizable side chain are provided. Preferably, the solid/solid PCM has a copolymer backbone having a polyolefin repeating unit, and the crystallizable side chains are grafted onto the copolymer backbone. Most preferably, the copolymer is poly(ethylene-co-glycidyl methacrylate) (PE-co-GMA), and polyethylene glycol (PEG) is the crystallizable side chain. Photovoltaic modules and backsheets for photovoltaic modules having solid/solid PCMs are also provided.

Copolymer of phase change material for thermal management of PV modules

An illustrative solar cell may include an electron conductor, an absorber, a hole conductor, and one or more other layers that help reduce interfacial charge recombination within the solar cell for improved solar cell efficiency. In one example, an electron inhibiting/hole transporting layer is provided that blocks or at least substantially inhibits movement of electrons that may otherwise move from within the absorber and/or electron conductor into the hole conductor of the solar cell, while permitting holes to travel from the absorber to the hole conductor. In some cases, the electron inhibiting/hole transporting layer may be transparent or substantially transparent to incident light so that the incident light may reach the absorber material.

Solar cell with electron inhibiting layer

A solar cell including a quantum dot, an electron conductor, and a rigid bridge molecule disposed between the quantum dot and the electron conductor. The rigid bridge molecule may include a first anchor group that bonds to the quantum dot and a second anchor group that bonds to the electron conductor. The solar cell may include a hole conductor that is configured to reduce the quantum dot once the quantum dot absorbs a photon and ejects an electron through the rigid bridge molecule and into the electron conductor.

Quantum dot solar cell with rigid bridge molecule

A solar cell may including a quantum dot, an electron conductor and a bridge molecule disposed between the quantum dot and the electron conductor. The bridge molecule may include a quantum dot anchor that bonds to the quantum dot and an electron conductor anchor that bonds to the electron conductor. The quantum dot anchor may be an electron-rich anchor group that includes a Group 5A element. The solar cell may also include a hole conductor that is configured to reduce the quantum dot once the quantum dot absorbs a photon and ejects an electron through the bridge molecule and into the electron conductor.

Quantum dot solar cell with electron rich anchor group

A solar cell including a quantum dot, an electron conductor, and a conjugated bridge molecule disposed between the quantum dot and the electron conductor. The conjugated bridge molecule may include a quantum dot anchor that bonds to the quantum dot and an electron conductor anchor that bonds to the electron conductor. In some instances, the quantum dot anchor and/or the electron conductor anchor may independently include two anchoring moieties that can form ring structures with the quantum dot and/or the electron conductor. The solar cell may further include a hole conductor that is configured to reduce the quantum dot once the quantum dot absorbs a photon and ejects an electron through the conjugated bridge molecule and into the electron conductor.

Growing community of inventors

Shanghai, China

Wei Jun Wang