Siliconware Precision Industries Co., Ltd.

Wei-Jhen Chen

Chang-Fu Lin

Yuan-Hung Hsu

Chih-Ming Huang

Chee-Key Chung

Don-Son Jiang

Yu-Lung Huang

Yi-Hsin Chen

Chih-Hsun Hsu

Chih-Nan Lin

An electronic package and a manufacturing method thereof, which embeds an electronic structure acting as an auxiliary functional component and a plurality of conductive pillars in an encapsulation layer, and disposes an electronic component on the encapsulation layer, so as to facilitate electrical transmission with the electronic component in a close range.

Electronic package and manufacturing method thereof

An electronic package is formed by arranging two encapsulating portions of different materials between a plurality of electronic components stacked to each other to adjust a stress distribution of the electronic package, so that the degree of warpage of the electronic package can be optimally controlled.

Electronic package

Growing community of inventors

Taichung, Taiwan

Wei-Jhen Chen