Htc Corporation

Other

Wei-Jen Chen

Li-Hsun Chang

Kuan-Ying Ou

Chih-Lin Chang

Jason Chia-Hsien Cheng

Yu-Jen Wang

Feipei Lai

An electronic device includes a circuit board, a package on package structure, a heat-conducting cover, and a heat-conducting fluid. The circuit board has a first surface and a second surface opposite to each other. The package on package structure is disposed on the first surface. The package on package structure has at least one heat generating element. The heat-conducting cover is disposed on the second surface and is in thermal contact with the circuit board. The heat-conducting cover and the second surface form an enclosed space. The heat-conducting fluid is filled in the enclosed space.

Electronic device with heat-conductive cover

A newly developed algorithm and software can effectively and accurately predict the collisions for the accelerator, phantom, and patient setups, and can help physicians to choose the noncolliding and optimized beam sets efficiently via offering the ideal hits of planning target volume (PTV) and constraints of organ at risks (OARs).

Method of beam angle optimization for radiation apparatus

A head mounted electronic device includes a casing assembly. The casing assembly includes an inner surface and an outer surface opposite to each other. The inner surface includes at least one inner hole, and the outer surface includes at least one outer hole. The inner hole and the outer hole are connected through and misaligned with each other. The application further discloses a head mounted electronic device cushion.

Head mounted electronic device and head mounted electronic device cushion

Growing community of inventors

Taoyuan, Taiwan

Wei-Jen Chen