Visera Technologies Company Limited

Semileds Optoelectronics Co., Ltd.

Wei-Hung Kang

Tzu-Han Lin

Chia-Yang Chang

Jui-Ping Weng

Tzy-Ying Lin

Chun-Chi Lin

Jung-Jung Kuo

Yu-Hui Lee

A white-light LED chip and a fabrication method thereof are provided. The white-light LED chip comprises a blue-light LED chip and a phosphor layer directly disposed on a top surface of the blue-light LED chip. The method comprises providing a plurality of blue-light LED chips attached to a substrate, wherein at least one contact pad is formed on the top surface of each blue-light LED chip. A protective layer is formed on the contact pad. A phosphor layer is formed on the top surface of the blue-light LED chip by a molding process, exposing the contact pad. Finally, the protective layer and the substrate are removed from the blue-light LED chip to form a white-light LED chip.

White-light light emitting diode chips and fabrication methods thereof

A light-emitting diode (LED) device is disclosed. The LED device includes a semiconductor substrate with a planar top surface, a light-emitting diode (LED) chip disposed over the top surface of the semiconductor substrate, at least two isolated outer wiring layers formed through the semiconductor substrate and electrically connected to the light-emitting diode chip, serving as input terminals, a transparent encapsulating layer with a substantially planar top surface formed over the semiconductor substrate, capping the LED chip and the at least two isolated outer wiring layers, and a lens module adhered to the substantially planar top surface of the transparent encapsulating layer to cap the light-emitting diode chip. In one embodiment, the lens module includes a fluorescent layer and a lens covering or covered by the fluorescent layer.

Light-emitting diode device and method for fabricating the same

A lens module and a method for fabricating the same are disclosed. The module comprises a substrate and a lens structure. The substrate comprises a through-hole therein. The lens structure is embedded in the through-hole.

Lens module and a method for fabricating the same

Growing community of inventors

Hsinchu, Taiwan

Wei-Hung Kang