Seagate Technology Incorporated

Seagate Technologies, Inc.

Wei Hu

Kim Yang Lee

Koichi R Wago

Yuan Xu

Justin Jia-Jen Hwu

David S Kuo

Xiaomin Yang

Zhaoning Yu

David Shiao-Min Kuo

Gene Gauzner

Henry Hung Yang

ShuaiGang Xiao

Michael R Feldbaum

Yautzong Hsu

Rene Johannes Marinus Van De Veerdonk

HongYing Wang

Provided herein is a method, including a) transferring an initial pattern of an initial template to a substrate; b) performing block copolymer self-assembly over the substrate with a density multiplication factor k; c) creating a subsequent pattern in a subsequent template with the density multiplication factor k; and d) repeating steps a)-c) with the subsequent template as the initial template until a design specification for the subsequent pattern with respect to pattern density and pattern resolution is met.

Block copolymer self-assembly for pattern density multiplication and rectification

A method of self-assembling density multiplied block copolymers (BCP) structures includes applying a block copolymer (BCP) to a feature-imprinted resist layer. The BCP is thermally annealed to laterally segregate the BCP into self-assembled columns of a first polymer block surrounded by a second polymer block.

Modified surface for block copolymer self-assembly

A method for nano-patterning includes imprinting features in a resist with an imprint mold to form one or more topographic surface patterns on the imprinted resist. A block copolymer ('BCP') material is deposited on the imprinted resist, wherein a molecular dimension Lof the BCP material correlates by an integer multiple to a spacing dimension of the one or more topographic surface patterns on the imprinted resist. The deposited BCP is annealed and at least a portion of the annealed BCP is removed, forming a template having discrete domains.

Hybrid-guided block copolymer assembly

A planarization process may planarize a media disk that has data trenches between data features and larger servo trenches between servo features. A filler material layer is deposited on the media disk and provides step coverage of the trenches. The filler material has data recesses over the data trenches and servo recesses over the servo trenches that must be removed to produce a planar media surface. A first planarization process is used to remove the data recesses and a second planarization process is used to remove the servo recesses.

Magnetic device with different planarization areas

Planarization method for media

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Newark, CA, United States of America

Wei Hu