Inventec Corp.

Inventec (pudong) Technology Corporation

Wei-Hsin Wu

Chih-Kai Yang

Yi-Lun Cheng

Feng-Ku Wang

Ming-Hung Lin

Hua-Feng Chen

The disclosure provides an electronic device and a heat dissipation module having an imaginary structural plane. The heat dissipation module includes a fin assembly, a connecting part and a heat pipe. The fin assembly is disposed on the structural plane and includes a plurality of fin elements extending along a first direction. The connecting part is connected to the fin elements. The fin elements are connected to each other via the connecting part. At least one portion of the connecting part is connected to at least one portion of the heat pipe, and the connecting part and the heat pipe both extend along a second direction. The fin assembly and the connecting part are integrated and formed into one piece by die casting. The first direction and the second direction form a first included angle greater than 0 degree.

Growing community of inventors

Taipei, Taiwan

Wei-Hsin Wu