Himax Display, Inc.

Himax Technologies, Inc.

Wei-Hsiao Chen

Chun-Hao Su

Tung-Feng Wu

Roland V Gelder

Jui-Wen Chen

Mao-Chien Cheng

Cheng-Chi Yen

Hon-Yuan Leo

Nan Liu

Chien-Tang Wang

Yao-Jen Tsai

Tore Nauta

Meng-Hsun Hsieh

Hui-Lun Chen

A manufacturing method of a microelectromechanical system (MEMS) package structure includes providing a base, wherein the base comprises a recess; disposing a chip in the recess, wherein the chip has an active surface; disposing a MEMS device on the active surface in the recess, wherein the MEMS device is covered by a first cover, the first cover comprises a cavity, and the MEMS device is in the cavity; disposing a sealant at a peripheral gap between the chip and the first cover so as to seal the cavity; disposing a glass frit on a second cover or the base; disposing the second cover on the base, wherein the second cover covers the recess, and the glass frit is disposed between the base and the second cover; and heating the glass frit so as to seal the recess.

Manufacturing method thereof

A microelectromechanical system (MEMS) device includes a substrate and at least one MEMS unit disposed on the substrate. The MEMS unit includes at least one first electrode, at least one second electrode, at least one landing element, and a hinge layer. The first electrode is disposed on the substrate. The second electrode is disposed on the substrate. The landing element is disposed on the substrate. The hinge layer includes a hinge portion and at least one cantilever portion. The hinge portion is connected to the second electrode. The cantilever portion is connected to the hinge portion. The cantilever portion has a first opening and at least one spring disposed in the first opening and connected to at least one side of the first opening. When a voltage difference exists between the first electrode and the second electrode, the hinge portion is distorted and the spring thus touches the landing element.

Microelectromechanical system device having a hinge layer

A MEMS package structure includes a base, a MEMS device, a first cover, a second cover and a glass frit. The base includes a recess. The MEMS device is disposed in the recess. The first cover is disposed in the recess and covering the MEMS device. The second cover is disposed on the base and covering the recess. The glass frit is disposed between the base and the second cover. A MEMS package structure includes the base, the MEMS device, the first cover, a second cover, a first metal frame and a first sealing medium. The first metal frame is disposed around the second cover, and the second cover and the first metal frame collectively are disposed on the base and covering the recess. The first sealing medium is disposed between the first metal frame and the base. Manufacturing methods of the MEMS package structures above are further provided.

MEMS package structure and manufacturing method thereof

A MEMS package structure including a chip, a MEMS device, a lid, a sealant and a first moisture barrier is provided. The chip comprises an active surface. The MEMS system device is disposed on the active surface. The lid is covered on the chip and comprising a recess, wherein the MEMS device is in the recess. The sealant is disposed between the chip and the lid so as to seal the recess, wherein a thickness of the sealant is less than a height of the MEMS device. The first moisture barrier is sealed around the chip, the sealant and the lid.

MEMS package structure

A color filter including a substrate, a plurality of first single-layer filter units and a plurality of first multilayer filter units is provided. The substrate has a plurality of first regions and a plurality of second regions. The first single-layer filter units is disposed on the substrate and located in the first regions respectively. The first multilayer filter units is disposed on the substrate and located in the second regions respectively. A manufacturing method for a color filter is also provided.

Color filter and manufacturing method thereof

A reflective type liquid crystal panel including a substrate, an array of transistors, capacitors, metal patterns, conductive walls, reflective pixel electrodes, an opposite substrate, and a liquid crystal layer is provided. The transistors and the capacitors are disposed on the substrate, and the capacitors are surrounding drain terminals of the corresponding transistors respectively. The metal patterns cover the corresponding transistors and overlap the corresponding capacitors respectively, and the metal patterns are electrically connected to the corresponding drain terminals respectively. The conductive walls surround the corresponding transistors and are connected between the corresponding metal patterns and the corresponding capacitors respectively. The reflective pixel electrodes are disposed over the corresponding metal patterns and electrically connected to the corresponding drain terminals respectively. The opposite substrate has a transparent electrode layer thereon, and the liquid crystal layer is disposed between the transparent electrode layer and the reflective pixel electrodes.

Reflective type liquid crystal panel and pixel structure thereof

The invention relates to a method for manufacturing a mirror device with anti-reflective coating layer. The method of the invention comprises: (a) forming an anti-reflective metal film on a first surface of a mirror material to be a mirror device; (b) defining a plurality of mirror units from the mirror device, each mirror unit having a mirror layer and an anti-reflective metal film unit, the anti-reflective metal film unit formed on a first surface of the mirror layer; and (c) defining an anti-reflective coating layer from the anti-reflective metal film unit, the anti-reflective coating layer formed on edges of the first surface of the mirror layer. According to the invention, the anti-reflective coating layer on the mirror layer can shield a bright area caused by fringe effect so as to minimize the bad influence of the fringe effect. In manufacture, the method of the invention follows the semiconductor manufacturing process, and has high precision and simple process.

Mirror device with anti-reflective coating layer and method for manufacturing the same

A color filter comprising first filtering units, second filtering units, and third filtering units is provided. The first filtering unit is manufactured according to a number of first pattern of a first mask, wherein each of the first patterns comprises a first main pattern portion and a number of first compensating portions. The second filtering unit is manufactured according to a number of second patterns of the second mask. The first compensating portions enable each first filtering unit to be smoothly coupled with the adjacent second filtering unit.

Growing community of inventors

Tainan, Taiwan

Wei-Hsiao Chen