Foxconn Technology Co., Ltd.

Furui Precise Component (kunshan) Co., Ltd.

Wei-Hsiang Chang

Ming-Tang Zhang

Nien-Tien Cheng

Jin-Huai Zhou

Zhen Tang

Jian Sun

Xi-Yuan Shen

A heat dissipation device includes a base and a fastener. The fastener includes a clasping portion, an elastic member placed and a first gasket. The clasping portion includes a fixing part, an operating part, and a connecting part connected to the fixing part and the operating part. The connecting part defines a slip groove. The first gasket interferingly fits the slip groove of the clasping portion. The elastic member is placed around the connecting part of the clasping portion and is arranged between the operation part and the first gasket. The first gasket abuts the base after the fixing part extending through the base.

Heat dissipation device having fastener

A heat dissipation device includes a base and a fastener. The fastener includes a neck portion, a head portion formed at one end of the neck portion, and an engaging portion formed at another opposite end of the neck portion. The base defines a receiving portion through the base. The receiving portion includes an inserting hole and a mounting hole communicating with the inserting hole. A flange extends upwardly from the base toward the mounting hole. The engaging portion extends through the inserting hole from a top of the base to make the neck portion enter the inserting hole. The neck portion is then crushed into the mounting hole from the inserting hole. A top face of the head portion abuts the flange, a bottom face of the head portion abuts the base.

Heat dissipation device with fastener and flange

A heat dissipation device includes a base and a fastener. The fastener includes a neck portion, a head portion formed at one end of the neck portion, and an engaging portion formed at another opposite end of the neck portion. The base defines a receiving portion through the base. The receiving portion includes an inserting hole and a mounting hole communicating with the inserting hole. The engaging portion extends through the inserting hole from a top of the base to make the neck portion enter the inserting hole. The neck portion is then crushed into the mounting hole from the inserting hole. The engaging portion abuts the bottom side of the base at a periphery of the mounting hole. The head portion abuts the top side of the base at the periphery of the mounting hole.

Heat dissipation device with fastener

An exemplary method of manufacturing a heat dissipation device includes, firstly, providing a heat pipe including a condenser section having a planar outer surface, and providing a heat sink including a supporting surface defining a guiding line. The guiding line has a width smaller than a width of the outer surface of the condenser section. Next, an amount solder is spread on the supporting surface along the guiding line to form a solder layer on the supporting surface. The solder layer has a size not larger than a size of the outer surface of the condenser section. Then the outer surface of condenser section of the heat pipe is attached to the solder layer on the supporting surface of the heat sink.

Manufacturing method of a heat dissipation device with guiding lines and soldered heat pipes

A heat dissipation device with guiding line and soldered heat pipe includes a heat pipe and a heat sink. The heat pipe includes a condenser section and an evaporator section. The condenser section has a planar outer surface. The heat sink includes a supporting surface contacting the outer surface of the condenser section. A guiding line is defined in the supporting surface for spreading solder therealong. The guiding line has a width smaller than a width of the outer surface of the condenser section. The condenser section of the heat pipe is mounted on the supporting surface of the heat sink along the guiding line and firmly connected to the heat sink by the solder.

Heat dissipation device with guiding line and soldered heat pipe

A heat dissipation device includes a heat pipe and a heat sink. The heat pipe includes a condenser section and an evaporator section. The condenser section has a planar outer surface. The heat sink includes a supporting surface for contacting the outer surface of the condenser section. A guiding line is defined in the supporting surface for spreading a solder therealong. The guiding line has a width smaller than a width of the outer surface of the condenser section. The condenser section of the heat pipe is mounted on the supporting surface of the heat sink along the guiding line and firmly connected to the heat sink by the solder.

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Taipei, Taiwan

Wei-Hsiang Chang