Advanced Semiconductor Engineering, Inc.

Wei-Hong Lai

Chin-Li Kao

Chia-Ching Chen

Tang-Yuan Chen

Chi-Yu Wang

Yuan-Ting Lin

Hung-Jen Chang

A semiconductor device includes a first die, a second die, an encapsulant, a first dielectric layer, and at least one first trace. The first die includes a first surface and a second surface opposite to the first surface and includes at least one first pad disposed adjacent to the first surface of the first die. The second die includes a first surface and a second surface opposite to the first surface and includes at least one second pad disposed adjacent to the first surface of the second die. The first dielectric layer is disposed on at least a portion of the first surface of the first die and at least a portion of the first surface of the second die. The first trace is disposed on the first dielectric layer, which connects the first pad to the second pad, and the first trace comprises an end portion disposed adjacent to the first pad and a body portion, and the end portion extends at an angle &#x3b8;relative to a direction of extension of the body portion.

Semiconductor devices and methods of manufacturing the same

Described herein are interposer substrate designs for warpage control, semiconductor structures including said interposer substrates, and fabricating processes thereof. An interposer substrate defines a cavity and further includes a reinforcement structure, wherein the reinforcement structure is used to control warpage of the semiconductor package structure.

Interposer substrate, semiconductor structure and fabricating process thereof

Growing community of inventors

Kaohsiung, Taiwan

Wei-Hong Lai