Showa Denko Packaging Co., Ltd.

Showa Denko Packaing Co., Ltd.

Wei He

Makoto Karatsu

Takashi Nagaoka

Terutoshi Kumaki

Provided is a packaging material for a power storage device capable of securing excellent formability without causing pinholes and/or cracks even when deep depth forming is performed and also capable of sufficiently preventing delamination even when deep depth forming is performed or even when it is used under severe environments, such as, e.g., high temperature and high humidity. [Solving means] The packaging material for a power storage device has a configuration including a heat resistant resin layerserving as an outer layer, a heat fusible resin layerserving as an inner layer, and a metal foil layerdisposed between both the two layers. The heat resistant resin layeris composed of a heat resistant resin film with a hot water shrinkage percentage of 1.5% to 12%. The heat resistant resin layerand the metal foil layerare bonded via an outer adhesive layercomposed of a cured film of an electron beam curable resin composition.

Exterior material for power storage device and power storage device

A packaging material for a power storage device includes a base material layer as an outer layer, a heat fusible resin layer as an inner layer, and a metal foil layer arranged between both the layers. The base material layer and the metal foil layer are adhered via an outer adhesive layer. The outer adhesive layer is formed of a cured film of a two-part curing type urethane adhesive agent including a main agent containing a polyol and a multifunctional isocyanate mixture, wherein a content rate of the polyol is 50 mass % to 95 mass %. The multifunctional isocyanate mixture is composed of a mixture containing an aromatic multifunctional isocyanate and an aliphatic multifunctional isocyanate having an aromatic ring.

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Kanagawa, Japan

Wei He