Applied Materials, Inc.

Wei Hao Kew

Arvind Sundarrajan

Guan Huei See

Upendra V Ummethala

Michael C Kutney

Glen T Mori

Prayudi Lianto

Gaurav Mehta

Pin Gian Gan

Amulya Ligorio Athayde

Ramesh Chidambaram

Ricardo Fujii Vinluan

Muhammad Adli Danish Bin Abdullah

Sik Hin Chi

Mark McTaggart Wylie

Shih-Chao Hung

Methods and apparatus perform backside via reveal processes using a centralized control framework for multiple process tools. In some embodiments, a method for performing a backside via reveal process may include receiving process tool operational parameters from process tools involved in the backside via reveal process by a central controller, receiving sensor metrology data from at least one or more of the process tools involved in the backside via reveal process, and altering the backside reveal process based, at least in part, on the process tool operational parameters and the sensor metrology data by adjusting two or more of the process tools involved in the backside via reveal process. The profile parameters are configured to prevent backside via breakage during a chemical mechanical polishing (CMP) process.

Methods and apparatus for backside via reveal processing

Growing community of inventors

Singapore, Singapore

Wei Hao Kew