Auras Technology Co., Ltd.

Wistron Corporation

Wiwynn Corporation

Wei-Hao Chen

Chien-Yu Chen

Chien-An Chen

Chih Chang

Tian-Li Ye

Yun-Kuei Lin

Kuo-Hua Tsai

Wei-Li Huang

Chun-Chi Lai

Yuh-Shiuan Liu

Jian-Dih Jeng

Jen-Hsien Lo

Sheng-Chieh Tsai

Bo-Zhang Chen

A fan cage assembly includes a cage and a handle mechanism, the handle mechanism includes a mount member including a mount portion and an extension portion respectively located at different sides of the cage and an operative member movably disposed on the extension portion of the mount member.

Fan cage assembly and electronic device including the same

A fluid cooling device includes a bottom plate, an adhesive layer and a spray cooling cover. The bottom plate includes a substrate and a chip, and the spray cooling cover is fixed on the bottom plate by an adhesive layer. In addition, the spray cooling cover includes a fluid inlet and a plurality of fluid outlets to utilize a working fluid to cool the chip directly.

Fluid cooling device

A case is provided, including a shell, a fan frame, and a fan module. The shell is internally provided with a backplane and a motherboard, where the motherboard is connected to the backplane along a first axis, the backplane is connected with a plug connector, the plug connector includes a plug connector body and a plurality of connection terminals, and the connection terminals are located in the plug connector body. The fan frame bears the fan module, and the fan module includes a fan assembly and a matching connector. The matching connector is connected to the fan assembly, and the matching connector is connected to the plug connector along a second axis. The matching connector includes a matching connector body and a plurality of matching terminals, and the matching terminals are located in the matching connector body. The fan frame is fixed in the shell.

Case, fan module and fan frame

An electronic package includes an electronic component and a heat dissipation structure, wherein the heat dissipation structure has a plurality of bonding pillars, and a metal layer is formed on the bonding pillars, so as to stably dispose the heat dissipation structure on the electronic component via the bonding pillars and the metal layer.

Electronic package and heat dissipation structure thereof, comprising bonding pillars

A fixing mechanism is applied to an interface card assembly and an electronic apparatus. The fixing mechanism includes a movable window and an operation component. The movable window is slidably disposed on a casing of the interface card assembly. The operation component has a fixed end and a free end opposite to each other. The fixed end is disposed on the movable window. The free end is detachably engaged with the casing to position the movable window. The movable window is positioned on one of a first region and a second region of the casing for respectively fixing interface cards with different sizes to the casing.

Fixing mechanism, interface card assembly and electronic apparatus

A liquid cooling device includes a heat dissipation shell and a dual fin module. The heat dissipation shell includes a cooling cavity, and the dual fin module is fixed in the cooling cavity to separate the cooling cavity into an upper cooling space and a lower cooling space, so that a cooling fluid enters the cooling cavity and flows into the upper cooling space and the lower cooling space to cool a chip in the lower cooling space.

Liquid cooling device

A heat dissipation module is provided and includes a cold plate having a housing, and a frame body disposed on the housing and having two sidewalls and at least one first rib, where the two sidewalls are positioned at two sides of the housing, respectively, and the first rib is used to provide a deformation resistance so that the heat dissipation module will not be seriously deformed when secured.

Heat dissipation module

A server apparatus includes a casing having a first engaging structure, a tray mechanism including a tray, a handle and an elastic member, and a server module disposed on the tray. The handle is pivoted to the tray. The elastic member connected to the tray and has an interfering structure. The interfering structure interferes with the handle to position the handle for making the handle not interfere with the first engaging structure when the tray is inserted into the casing along an insertion direction.

Server apparatus and tray mechanism thereof

A coolant distribution unit includes a casing, a control module, a power supply module, a heat exchange module, and a fluid driving module. The power supply module is electrically connected to the control module, the fluid driving module is electrically connected to the control module and the power supply module, and the fluid driving module is in fluid communication with the heat exchange module. The control module, power supply module, heat exchange module, and fluid driving module are all arranged in the casing. In addition, the control module controls the power supply module to output a corresponding electrical power to the fluid driving module according to an operation status of the fluid driving module.

Coolant distribution unit

A server device is provided. The server device includes a substrate, a first server module, a first cable, a second server module and a second cable. The first server module includes a first server board and a first recognition unit, wherein the first recognition unit is connected to the first server board. The first cable is connected to the substrate, wherein the first cable is connected to the first recognition unit, and the first recognition unit generates a first recognition signal. The second server module includes a second server board and a second recognition unit. The second recognition unit is connected to the second server board. The second cable is connected to the substrate. The second cable is connected to the second recognition unit, and the second recognition unit generates a second recognition signal. The server device determines whether the server module is coupled to the correct joint.

Server device

A water-cooling head includes a casing, an inclined flow-guiding structure and a bottom plate assembly. The casing includes an inlet and an outlet. A liquid is fed into the inlet. The inclined flow-guiding structure is disposed within the casing, and includes plural first openings. A bottom end of the inclined flow-guiding structure is located under the inlet. A top end of the inclined flow-guiding structure is arranged beside the outlet. The top end is located at a level higher than the bottom end. A second opening is formed in the bottom end. The bottom plate assembly is assembled with the casing, and located under the inclined flow-guiding structure. The bottom plate assembly includes a fin group. After the liquid is transferred to the fin group through the second opening or the plural first openings, the liquid is exited from the outlet.

Growing community of inventors

Taipei, Taiwan

Wei-Hao Chen