Industrial Technology Research Institute

Intellectual Property Innovation Corporation

Other

National Taiwan Normal University

Wei-Han Chen

Tai-Jui Wang

Tsu-Chiang Chang

Jing-Yi Yan

Chieh-Wei Feng

Shao-An Yan

Wu-Wei Tsai

Wei-Cheng Kao

Cheng-Chung Lee

Jia-Chong Ho

Shin-Hong Kuo

Yi-Hsiang Huang

Yu-Hua Chung

Hsiao-Chiang Yao

Tzyy-Yuang Shiang

Chiang Liu

En-Tzu Wang

Wen-Hsuan Pan

Meng-Jung Yang

Wen-Wen Yang

Ya-Chen Liu

A reaction force detection system for treadmills and detection method thereof is disclosed, wherein the system detects the current data generated by a user running on a treadmill comprising a running belt, a motor and an electronic circuit device by means of a current sensor, and then determines a current peak based on the current data, such that a ground reaction force peak can be determined according to the acquired current peak. Therefore, the present invention allows to determine the ground reaction force of the human body during running through the changes of the motor current signals inside the treadmill, such that these parameters can be further presented, analyzed, and stored in order to provide more scientific feedbacks for running trainings.

Reaction force detection system for treadmills and detection method thereof

A pixel structure including a substrate, a power wire, a planarization layer, a drive circuit and a conductive structure is provided. The substrate has a layout area and a light-transmitting area located outside the layout area. The power wire is disposed on the layout area of the substrate. The power wire includes a shielding layer. The planarization layer is disposed on the substrate and covers the power wire. The drive circuit is disposed on the planarization layer and corresponds to the layout area. The drive circuit includes a first active device. The shielding layer overlaps with the first active device. The conductive structure is disposed in the planarization layer and distributed corresponding to the layout area. The power wire is electrically connected with the drive circuit through the conductive structure. A display panel is also provided.

Pixel structure and display panel

A liquid buoyancy muscle training device includes a liquid receiving tank receiving and holding liquid therein. A buoyantly submergible member is buoyantly submergible in the liquid contained in the liquid receiving tank and includes a regulation chamber formed therein. A bottom pulley is mounted inside the liquid receiving tank. A rope is connected to the buoyantly submergible member and wrapped around the bottom pulley and extends upward to project outside the liquid receiving tank. A liquid regulation tank is connected through a liquid supply tube to the regulation chamber to allow liquid to flow therebetween. A gas supplier is connected through a gas supply tube to the regulation chamber to selectively supply gas into the regulation chamber to change a ratio between liquid and gas inside the regulation chamber so as to change buoyance applied to the buoyantly submergible member by the liquid contained in the liquid receiving tank.

Liquid buoyance muscle training device

A photoelectric device package including a substrate, a first circuit layer, a carrier structure, a second circuit layer, at least one photoelectric device, and a first encapsulation layer is provided. The first circuit layer is disposed on the substrate. The carrier structure is disposed on the substrate and covers the first circuit layer. The carrier structure includes a first dielectric layer, a second dielectric layer, and an elastic layer disposed between the first dielectric layer and the second dielectric layer. The Young's modulus of the elastic layer is less than the Young's modulus of the first dielectric layer and the second dielectric layer. The second circuit layer is disposed on the carrier structure. The photoelectric device is disposed on the carrier structure and is electrically connected to the first and second circuit layers. The first encapsulation layer is disposed on the carrier structure and encapsulates the photoelectric device.

Photoelectric device package

A semiconductor device is provided to include a flexible substrate, a barrier layer, a heat insulating layer, a device layer, a dielectric material later and a stress absorbing layer. The barrier layer is disposed on the flexible substrate. The heat insulating layer is disposed on the barrier layer, wherein the heat insulating layer has a thermal conductivity of less than 20 W/mK. The device layer is disposed on the heat insulating layer. The dielectric material layer is disposed on the device layer, and the dielectric material layer and the heat insulating layer include at least one trench. The stress absorbing layer is disposed on the dielectric material layer, and the stress absorbing layer fills into the at least one trench.

Semiconductor device

A transistor device including a semiconductor material layer, a gate layer, and an insulation layer between the gate layer and the semiconductor material layer is provided. The semiconductor material layer includes a first conductive portion, a second conductive portion, a channel portion between the first conductive portion and the second conductive portion, and a first protruding portion formed integrally. The channel portion has a first boundary adjacent to the first conductive portion, a second boundary adjacent to the second conductive portion, a third boundary, and a fourth boundary. The third boundary and the fourth boundary connect the terminals of the first boundary and the second boundary. The first protruding portion is protruded outwardly from the third boundary of the channel portion. The first gate boundary and the second gate boundary are overlapped with the first boundary and the second boundary of the channel portion.

Transistor device having protruding portion from channel portion

An electronic device including at least one electronic component and a method of manufacturing the same are provided. The electronic device may include a substrate, a semiconductor layer disposed on the substrate, an insulating layer disposed on the semiconductor layer, and a first metal layer disposed on the insulating layer. The insulating layer may have a pattern corresponding to a pattern of the semiconductor layer or the first metal layer. The flexible layer has a Young's modulus less than 40 GPa and is disposed on the substrate to encapsulate the semiconductor layer. At least one first opening penetrates the flexible layer. At least one second metal layer is disposed on the flexible layer and in the first opening and electrically connected to the semiconductor layer.

Electronic device and method of manufacturing the same

An electronic component and a method for fabricating the electronic component are provided. The electronic component includes a carrier, a first metal layer, a dielectric layer, a semiconductor layer, a flexible layer, at least one first opening, and at least one second metal layer. The first metal layer is disposed on the carrier. The dielectric layer is disposed on the first metal layer, and has a pattern consistent with a pattern of the dielectric layer. The semiconductor layer is disposed on the dielectric layer. The flexible layer is disposed on the carrier and encapsulates the first metal layer, the dielectric layer and the semiconductor layer. The flexible layer has a Young's modulus less than 40 GPa. The first opening penetrates the flexible layer. The second metal layer is disposed on the flexible layer and in the first opening and is electrically connected with the semiconductor layer.

Electronic component and method for fabricating the same

Growing community of inventors

Taipei, Taiwan

Wei-Han Chen