Kingston Technology Corporation

Grumman Aerospace Corporation

Other

Express Packaging Systems, Inc.

Grunman Aerospace Corporation

Wei H Koh

David E Chen

George Shiu

Ben Wei Chen

Fred Kong

William B Hornback

Connie S McCausland

Allen L Solomon

David Hong-Dien Chen

Daniel Yu Hsu

John Pei Ho

John H Lau

Kuan Luen Chen

Tai-Yu Chou

Yung Shih Chen

Alan E Ingall

David H D Chen

Frank H Wu

A sectioned tablet smartphone device that is bendable for use as a wearable for carrying around or hands-free applications; the device is comprised of a plurality of short body sections linked by bendable hinges that are integrated to device casing, a bendable and slidable front touchscreen display connected to an extension stored in a rotating end scroll, and a detachable strap on casing backside as a protective cover when device is in tablet mode and as a wristband when device is in wearable mode.

Sectioned wearable smartphone devices

A wearable electronics device having a removable thin top touchscreen that is interchangeable to other touchscreens having different sizes and shapes to convert the device form factor and functions from a fitness-tracker to a smartwatch or a handheld smartphone, using an applications processor in the underlying electronics housing unit capable of running the device in various form factors. The smartphone touchscreen further provides additional power and memory/storage for smartphone-level functions and performance.

Thin mobile and wearable devices

A mobile electronic smartphone device having a wedge-shaped body comprised of a curved and slanted display gradually tapered towards the thin end, and a thick head section comprised of a battery compartment and a modular, rotatable or replaceable camera module. The display may be rigid LCD, OLED, microLED with a rigid glass cover. Optionally, flexible, bendable display with stretch-rigid circuit backing and flexible cover screen may be used for a foldable or rollable device, comprised of a bending hinge located at or below the mid-section of the display body, wherein the thinner display section is bendable against the thicker section of the front display. Another embodiment of the wedge body is comprised of rollable housing slats and a flexible display in the lower half thinner display section that can be rolled up like a scroll or lie-flat against the thicker part of the device body.

Foldable wedge-shaped mobile electronic device

A portable image capture and camera device is provided including a device body, and an upper panel displaceably engaged to the body, and having an image capture module disposed thereon. A lower panel is also displaceably engaged to the body, for receiving and supporting a subject when the lower panel is deployed to an open position. The upper panel is translatable to deploy from a stowed position to a first deployed position to image a subject disposed on the lower panel (card reader mode), and to a second deployed position to image objects remote from the device (camera mode).

Portable image capture and camera device

A method of fabricating a chip may include the step of providing a first electrical part. The method may also include the step of forming a shell with the first electrical part embedded in a first side portion of the shell and a cavity in a second side portion of the shell. The method may include the step of testing the embedded first electrical part to determine whether the first electrical part is defective or functional. The method may also include the steps of providing a second electrical part, inserting the second electrical part within the cavity of the shell second side portion, establishing electrical communication between the first and second electrical parts if a test result of the first electrical part indicates that the first electrical part is functional, and finishing the chip. Also, the method may include the step of rejecting the first electrical part if the test result of the first electrical part indicates that the first electrical part is defective.

Method of fabricating a chip

Provided is a memory device comprising a circuit assembly including a flexible substrate and at least one flash memory chip mounted thereupon. The flexible substrate has upper and lower surfaces and a flash memory chip is preferably mounted on at least one the upper and lower surfaces. The flash memory chip may be configured as one of a thin small outline package (TSOP) package device, a very small outline package (WSOP) package device, and a chip on board (COB) device. The memory device may further comprise a hollow housing body having a hollow interior compartment sized and configured to receive the circuit assembly therewithin. A universal series bus (USB) connector may be mounted on a free end of the flexible substrate and is preferably configured to electrically connect the memory device to an electric device.

Folding USB drive

A data storage device and methods of manufacture are provided which tend to protect the device against moisture and shock. The device includes a circuit board, a coating, a housing, and preferably a sealant. The circuit board is in electrical communication with an electrical interface. The coating is disposed at least on the circuit board to generally encapsulate the circuit board. The housing is sized and configured to generally encompass the circuit board and the coating. The housing includes a housing opening being sized and configured with the electrical interface being at least partially exposed therethrough. The sealant is preferably disposed within the housing substantially intermediate the interior surface of the housing and the coating on the circuit board. Further, at least one of the coating and the sealant may be disposed substantially intermediate the electrical interface and the housing opening.

Waterproof USB drives and method of making

A thin, small outline IC leadframe plastic package to be used to assemble high performance, high speed semiconductor memory IC devices such as dynamic random access memories (DRAM) having a high data transfer rate in the range of 1 GigaHertz. The package leadframe is electrically interconnected to the IC device input-output pads by either electrically conductive (e.g. solder) bumps that are flip-chip bonded to the IC device or by of an interposer. The interposer contains integral curled micro-spring contacts at opposite ends of conductive fan out traces. The interposer is attached to the leadframe bonding pads by way of tape automated bonding, soldering, or adhesive bonding. The leadframe that is interconnected to the IC device by the aforementioned flip-chip bumps or the interposer is encapsulated and trimmed to form either gull-wing style perimeter leads as a standard thin small outline package (TSOP) or wrap around leads as a micro-leadframe (MLF) package.

Encapsulated leadframe semiconductor package for random access memory integrated circuits

A method is disclosed for making a leadframe package stand having application in semiconductor packaging and microelectronic assembly in which an IC device (e.g., a bare chip IC, a wafer level package, or a chipscale package) is received for electrical connection to a PWB or for vertical package over package stacking. Electrically conductive leadframe traces are arranged in an area array circuit pattern between outer leads at the periphery of the mold body of a leadframe for connection to the PWB to inner leads for connection to the IC device. The inner lead tips terminate at each side of the IC device in groups of parallel aligned rows and columns to facilitate connection to the IC device without using intermediate bonding wires. Prior to molding, the inner leads of the conductive traces are secured by sacrificial tie-bars or adhesive tape to prevent movement of the inner leads and possible short circuits during molding. A cavity is formed in the mold body during molding so as to lie above the inner leads. After molding, the sacrificial tie-bars are separated from the inner leads, and the IC device is located in the cavity to be assembled to the leadframe to complete a leadframe package.

Leadframe semiconductor package stand and method for making the same

A memory card assembly with a simplified structure. The memory card assembly has a memory card assembly a printed wiring board substrate and at least one integrated circuit unit mounted and electrically connected to the printed wiring board substrate. A rigid ring is fitted over a periphery of the printed wiring board substrate to encircle the integrated circuit die therein. Thereby, a dam with an open top is constructed over the printed wiring board substrate. A filler resin material is then filled within the open dam to cover the printed wiring board substrate and integrated circuit unit.

High-capacity memory card and method of making the same

Provided is a memory device comprising a circuit assembly including a flexible substrate and at least one flash memory chip mounted thereupon. The flexible substrate has upper and lower surfaces and a flash memory chip is preferably mounted on at least one the upper and lower surfaces. The flash memory chip may be configured as one of a thin small outline package (TSOP) package device, a very very small outline package (WSOP) package device, and a chip on board (COB) device. The memory device may further comprise a hollow housing body having a hollow interior compartment sized and configured to receive the circuit assembly therewithin. A universal series bus (USB) connector may be mounted on a free end of the flexible substrate and is preferably configured to electrically connect the memory device to an electric device.

A dual in-line memory module (DIMM) and a digital flash card are disclosed including an internal, built-in RFID tag in which identification and product information is contained. The RFID tag has an RF integrated circuit chip and antenna traces spreading outwardly therefrom to permit access to the information contained by the RF chip. In the case of a DIMM, the RF integrated circuit chip and its antenna traces are located on top of or between the layers of a multi-layer laminated printed wiring board substrate. In the case of a digital flash card, the RF integrated circuit chip and its antenna traces are preferably located on top of a multi-layer printed wiring board substrate and then encapsulated within a molded cover. In the alternative, the RF chip and its antenna traces are attached to the inside of a cover that extends over and is spaced above the printed wiring board substrate.

Memory module and card with integrated RFID tag

A memory card comprising a substrate, a memory die on top of the memory die, a controller die on top of the memory die; and a interposer surrounding the controller die and on top of the memory die wherein the interposer allows for wire bonding to the substrate to be minimized. A system and method in accordance with the present invention achieves the following objectives: (1) increase the density of the Flash card by reducing the number of wire bond pads on the substrate and enabling insertion of the largest die possible that can fit inside a given card interior boundary; (2) more efficiently stacks Flash memory dies when stacking is necessary, to increase density of the Flash card; (3) has only a few necessary signal I/O bonding wires to the substrate to improve production yield.

Growing community of inventors

Irvine, CA, United States of America

Wei H Koh