Carnegie Mellon University

Wei Gong

Sheng Shen

Pengfei Li

Lin Jing

Raghav Garg

Itzhaq Cohen-Karni

A high-performance thermal interface comprising a nanowire array disposed between a bottom metal layer and a top metal layer in which each nanowire is coated with a 3D fuzzy graphene layer. The thermal interface can be used by bonding it to the surfaces of adjoining substrates using layers of solder.

Nanowire-based thermal interface

A high-performance thermal interface material comprising a heterogeneous copper-tin nanowire array that is ultra-compliant and that can reduce thermal resistance by two times as compared with the state-of-the-art thermal interface materials. The high-performance thermal interface material can be further used in electronic systems, ranging from microelectronics to portable electronics to massive data centers, to operate at lower temperatures, or at the same temperature but with higher performance and higher power density.

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Pittsburgh, PA, United States of America

Wei Gong