Western Digital (fremont), Inc.

Beijing Tongmei Xtal Technology Co., Ltd.

Via Technologies, Inc.

Netgear, Inc.

Mdc Vacuum Products Corporation

Wei Gao

Ming Mao

Hai Sun

Miao Wang

Guanghong Luo

Guanxiong Li

Zhongyan Wang

Zhihong Zhang

Ge Yi

Yufeng Hu

Dujiang Wan

Lingyun Miao

Anup Roy

Ronald Chang

Wencheng Su

Sheng Yen

Ming Jiang

Wei Zhang

Yu Liu

Mirzafer K Abatchev

Tong Zhao

Shing Lee

Hong Zhang

Jinshan Li

Hongxing Yuan

Chih-Ching Hu

Ruolin Li

Yanfeng Chen

Xiaoyu Yang

Shawn M Tanner

Lily Yao

Yunjun Tang

Lijun Tong

Tiffany Yun Wen Jiang

Haimiao Li

Zhiqiang Zeng

Nick Tsujimoto

Paul Tien

Zhigang Zhou

Peter H Harris

Zhizhen Wang

James Yuan

The present invention provides a method for detecting surface haze of materials, comprising: optionally, preliminary inspection, which is conducted on materials, to identify the materials with no visible surface defects; and surface haze inspection, to detect the surface haze of the materials; wherein an optical filter module is configured in surface haze inspection setup to filter off the photoluminescence signal of the materials in the light path to the detector, so as to avoid the photoluminescence signal being detected by the detector. The invention further provides a setup for detecting surface haze of materials. By using the invented method and setup for detecting surface haze, it is possible to accurately obtain the surface haze value and/or distribution of the materials.

Method and setup for detecting surface haze of materials

A ventilated puck is provided. The ventilated puck includes an upper box, a spider plate, and a lower box. In particular, the upper box is fitted on the lower box to form a hollow structure, in which the spider plate is disposed. A ventilation channel for communicating the hollow structure with an external environment is provided in the upper box, or in the lower box or at interface between the upper box and the lower box. The ventilated puck of the present application may ensure gas exchange during the gas protection process conducted on semiconductor wafers, thereby preventing deformation of the puck due to pressure differences. Optionally, the interior of the ventilation channel is provided with a dustproof labyrinth structure, thereby preventing the entry of dust.

Ventilated puck

A ventilated wafer cassette is provided. The cassette comprises an upper box, a lower box, and an inner box, wherein the upper box is fitted on the lower box to form a hollow structure, in which the inner box is disposed. At least one ventilation channel connecting the hollow structure with an external environment is provided in the upper box, in the lower box or at the connection between the upper box and the lower box. The ventilated wafer cassette of the present application can ensure gas exchange during the gas protection process conducted on semiconductor wafers, thereby preventing deformation of the wafer cassette due to pressure differences. Preferably, the interior of the ventilation channel is provided with a dustproof labyrinth structure, thereby preventing the entry of dust.

Ventilated wafer cassette

Disclosed are methods for making ultra-narrow track width (TW) read sensors, and read transducers incorporating such sensors. The methods utilize side-wall line patterning techniques to prepare ultra-narrow mill masks that can be used to prepare the ultra-narrow read sensors.

Method for making ultra-narrow read sensor and read transducer device resulting therefrom

A method of fabricating a magnetic device includes forming a sensor having a pinned layer and a free layer. A first reactive ion etch of a sensor stack patterns a hard mask layer with a photoresist image to form a first hard mask. Then a second reactive ion etch is performed to form an extended pinned layer. The method also includes depositing an insulating layer after the second reactive ion etch to protect exposed edges of the sensor stack, and then providing a chemical mechanical planarization (CMP) stop layer on the insulating layer. Subsequently, a CMP of the sensor stack is performed to remove a portion of the insulating layer. The resulting structure is substantially free of residue on the back edges of the sensor.

Method to fabricate tunneling magnetic recording heads with extended pinned layer

A first layered structure includes a magnetic layer, a first hard mask layer, a second hard mask layer, and a first stepping layer. The first stepping layer is etched through to create a sidewall. A mask-width definition layer is deposited on and adjacent to the sidewall, until a mask-width definition layer thickness is achieved adjacent to the sidewall. The mask-width definition layer is removed except on the sidewall. The first stepping layer is removed. The second hard mask layer is etched away, except for a remainder of the second hard mask layer beneath the mask-width definition layer. The first hard mask layer is etched away around the remainder of the second hard mask layer, to form a dual layer hard mask comprising the remainder of the second hard mask layer and the remainder of the first hard mask layer. The magnetic layer is ion milled around the dual hard mask.

Method to fabricate a magnetic head including ion milling of read gap using dual layer hard mask

Disclosed are methods for making read sensors using developable bottom anti-reflective coating and amorphous carbon (a-C) layers as junction milling masks. The methods described herein provide an excellent chemical mechanical polishing or planarization (CMP) stop, and improve control in reader critical physical parameters, shield to shield spacing (SSS) and free layer track width (FLTW).

Reader fabrication method employing developable bottom anti-reflective coating

A method for fabricating a structure in magnetic recording head is described. First and second hard mask layers are provided on the layer(s) for the structure. A BARC layer and photoresist mask having a pattern are provided on the second hard mask layer. The pattern includes a line corresponding to the structure. The pattern is transferred to the BARC layer and the second hard mask layer in a single etch using an etch chemistry. At least the second hard mask layer is trimmed using substantially the same first etch chemistry. A mask including a hard mask line corresponding to the line and less than thirty nanometers wide is thus formed. The pattern of the second hard mask is transferred to the first hard mask layer. The pattern of the first hard mask layer is transferred to the layer(s) such that the structure has substantially the width.

Method and system for fabricating a narrow line structure in a magnetic recording head

A method provides an EAMR transducer. The EAMR transducer is coupled with a laser and has an ABS configured to reside in proximity to a media during use. The EAMR transducer includes an NFT for focusing the energy onto the media. A sacrificial layer is deposited on the NFT and a mask having an aperture provided on the sacrificial layer. A portion of the sacrificial layer exposed by the aperture is removed to form a trench above the NFT. A heat sink is then provided. At least part of the heat sink resides in the trench. The heat sink is thermally coupled to the NFT. Optical material(s) are provided around the heat sink. A write pole configured to write to a region of the media is also provided. The write pole is thermally coupled with the top of the heat sink. Coil(s) for energizing the write pole are also provided.

Method and system for providing an energy assisted magnetic recording writer having a heat sink and NFT

A storage apparatus and method configured to improve efficiency of data access utilizing dynamically adjusting storage zone boundary within a disk are disclosed. A process capable of implementing the flexible zone boundary, in one example, allocates a first zone of a first disk operable to store data. While the first zone can be referred to as a Redundant Array of Independent Disks 0 ('RAID 0') zone, the implementation of RAID 0 can be carried out in the first zone. Upon allocating a second zone of the first disk operable to store secured data, the process allocates a third zone of the first disk wherein the storage boundary of the first zone can be dynamically expanded into the third zone in response to the availability of free storage capacity of the first zone of the first disk.

Method and apparatus for dynamically adjusting memory capacity in accordance with data storage

A read sensor for a transducer is fabricated. The transducer has a field region and a sensor region corresponding to the sensor. A sensor stack is deposited. A hybrid mask including hard and field masks is provided. The hard mask includes a sensor portion covering the sensor region and a field portion covering the field region. The field mask covers the field portion of the hard mask. The field mask exposes the sensor portion of the hard mask and part of the sensor stack between the sensor and field regions. The sensor is defined from the sensor stack in a track width direction. Hard bias layer(s) are deposited. Part of the hard bias layer(s) resides on the field mask. Part of the hard bias layer(s) adjoining the sensor region is sealed. The field mask is lifted off. The transducer is planarized.

Method for fabricating a read sensor for a read transducer

A method and system for providing an optical grating are described. The optical grating is configured for light of a wavelength and includes a first optically transparent layer, a stop layer on the first optically transparent layer, and a second optically transparent layer on the stop layer. The first optically transparent layer is continuous and includes a material. The second optically transparent layer also includes the material. The second optically transparent layer also includes a plurality of discrete ridges spaced apart by a pitch. The stop layer is configured to be invisible to the light.

Optical grating and method of manufacture

A method of forming an energy assisted magnetic recording (EAMR) writer is disclosed. A structure comprising a bottom cladding layer and a near field transducer (NFT) is provided. A patterned sacrificial layer is formed over the structure. A top cladding layer is deposited over the patterned sacrificial layer and a remaining region of the structure not covered by the patterned sacrificial layer. A patterned resist is formed over the top cladding layer. A first etching operation is performed on the top cladding layer via the patterned resist, whereby a top cladding having a sloped region is formed. The patterned sacrificial layer provides an etch stop for the first etching operation.

Method of forming a dielectric slope for EAMR and magnetic writer

A method and system for providing an energy assisted magnetic recording (EAMR) transducer coupled with a laser are described. The laser provides energy. The EAMR transducer has an air-bearing surface (ABS) configured to reside in proximity to a media during use. The EAMR transducer includes a near field transducer (NFT) proximate to the ABS for focusing the energy onto the region of the media. The method and system include providing a heat sink having a bottom thermally coupled with the NFT and a top surface at an angle with respect to the ABS. The angle is greater than zero and less than ninety degrees. The method and system also include providing a write pole and at least one coil. The write pole is configured to write to a region of the media. The write pole has a bottom surface thermally coupled with the top surface of the heat sink. The at least one coil is for energizing

Method and system for providing an energy assisted magnetic recording writer having an integrated NFT, heat sink, and pole

A method and system for fabricating a microelectric device are described. A write pole of an energy assisted magnetic recording head or a capacitor might be fabricated. The method includes depositing a resist film and curing the resist film at a temperature of at least 180 degrees centigrade. A cured resist film capable of supporting a line having an aspect ratio of at least ten is thus provided. A portion of the cured resist film is removed. A remaining portion of the resist film forms the line. An insulating or nonmagnetic layer is deposited after formation of the line. The line is removed to provide a trench in the insulating or nonmagnetic layer. The trench has a height and a width. The height divided by the width corresponds to the aspect ratio. At least part of the structure is provided in the trench.

Method for fabricating a structure for a microelectric device

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Fremont, CA, United States of America

Wei Gao