Momentive Performance Materials Gmbh

Wei Fan

John T Mariner

Xiang Liu

Marc Schaepkens

Ajit Sane

Toshiki Ebata

Creighton Tomek

Benjamin John Olechnowicz

David Michael Rusinko, Jr

Douglas Alan Longworth

Manjunath Subbanna

Gregory Shaffer

Jeffrey Lennartz

Aaron Rape

David M Rusinko, Jr

Sudarshan Natarajan

Tae Won Kim

Eelco Galestien

Eric Wintenberger

The present technology provides a non-cylindrical structure for transporting media, including gases, liquids, solids, or energy comprising a layer of thermal pyrolytic graphite (TPG) surrounded by an outer layer and an inner layer comprising a metal, a ceramic, a glass, or a plastic. In particular, the present technology relates to a non-cylindrical tube or a pipe having an inner layer, an outer layer, and a layer of TPG between the inner layer and the outer layer wherein the TPG layer is configured to manage the direction of heat conduction.

Thermal pyrolytic graphite tube device for directional thermal management

A thermal management assembly comprising a bulk graphene material and a metal-based coating layer disposed on opposing surfaces of the bulk graphene core material comprising an agent that is reactive with the graphene to form a carbide. The metal-based coating layer can serve as an outer layer of the assembly or can serve to bond the graphene to other materials encapsulating the graphene core. The metal-based coating layer with the reactive agent provides an assembly exhibiting excellent thermal conductivity properties and greatly improved thermal interface resistance.

Thermal management assembly comprising bulk graphene material

A light emitting diode assembly comprising such thermal management assembly is shown and described herein. The light emitting diode assembly may comprise a light emitting diode in thermal contact with a heat spreader. The heat spreader may comprise a core and/or fins. The core and/or fins comprise a thermal pyrolytic graphite material. The thermal management assembly comprising the core and/or fins can dissipate heat from the light emitting diode.

Light emitting diode assembly using thermal pyrolytic graphite for thermal management

A high thermal conductivity/low coefficient of thermal expansion thermally conductive composite material for heat sinks and an electronic apparatus comprising a heat sink formed from such composites. The thermally conductive composite comprises a high thermal conductivity layer disposed between two substrates having a low coefficient of thermal expansion. The substrates have a low coefficient of thermal expansion and a relatively high modulus of elasticity, and the composite exhibits high thermal conductivity and low coefficient of thermal expansion even for composites with high loadings of the thermally conductive material.

High thermal conductivity/low coefficient of thermal expansion composites

A heating apparatus for regulating/controlling the surface temperature of a substrate is provided. At least a thermal pyrolytic graphite (TPG) layer is embedded in the heater to diffuse the temperature difference of the various components in the heating apparatus and provide temporal and spatial control of the surface temperature of the substrate, for a relatively uniform substrate temperature with the difference between the maximum and minimum temperature points on the substrate of less than 10&#xb0; C.

Heating apparatus with enhanced thermal uniformity and method for making thereof

A layered heater structure including an electrode layer and a localized tuning method for tuning the electrode layer of a layered heater structure with high precision is provided. The localized tuning method tunes the electrode layer to its proper local resistance to minimize temperature offsets on the heater surface and thus provide a desired thermal profile that is in marked contrast to conventional, non-localized resistance tuning approaches based on thickness trimming practices, such as grinding or blasting, or resistivity adjustment, such as local heat treatment.

Electrode tuning method and apparatus for a layered heater structure

A wafer processing apparatus is fabricated by depositing a film electrode onto the surface of a base substrate, the structure is then overcoated with a protective coating film layer comprising at least one of a nitride, carbide, carbonitride or oxynitride of elements selected from a group consisting of B, Al, Si, Ga, refractory hard metals, transition metals, and combinations thereof. The film electrode has a coefficient of thermal expansion (CTE) that closely matches the CTE of the underlying base substrate layer as well as the CTE of the protective coating layer.

Etch resistant wafer processing apparatus and method for producing the same

A heat treatment apparatus for use in batch heating/wafer processing is provided, which comprises a process chamber for receiving a wafer boat, at least a heating element comprising a substrate body configured to form an electrical heating circuit for at least one heating zone and encapsulated in a continuous overcoat layer, a heat reflector comprising a heat reflective surface disposed on the heating element, and the heating element has a ramp rate of at least 1&#xb0; C. per second for heating the wafers in the wafer boat.

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Strongsville, OH, United States of America

Wei Fan