Applied Materials, Inc.

Wei Dou

Yong Cao

Shane Lavan

Mingdong Li

Mark Joseph Saly

Xianmin Tang

Feng Quan Liu

Kirankumar Neelasandra Savandaiah

Rongjun Wang

Bhaskar Jyoti Bhuyan

Liqi Wu

Jothilingam Ramalingam

David Michael Thompson

Jiang Lu

Jie Zhang

Madan Kumar Shimoga Mylarappa

Aixi Zhang

Zhimin Qi

Sundarapandian Ramalinga Vijayalakshmi Reddy

Chengyu Liu

James Hugh Connolly

Avinash Nayak

Target profile for a physical vapor deposition chamber target

Embodiments of the disclosure relate to methods for selectively removing metal material from the top surface and sidewalls of a feature. The metal material which is covered by a flowable polymer material remains unaffected. In some embodiments, the metal material is formed by physical vapor deposition resulting in a relatively thin sidewall thickness. Any metal material remaining on the sidewall after removal of the metal material from the top surface may be etched by an additional etch process. The resulting metal layer at the bottom of the feature facilitates selective metal gapfill of the feature.

Selective metal removal with flowable polymer

Embodiments of methods and apparatus for reducing particle formation in physical vapor deposition (PVD) chambers are provided herein. In some embodiments, a method of reducing particle formation in a PVD chamber includes: performing a plurality of first deposition processes on a corresponding series of substrates disposed on a substrate support in the PVD chamber, wherein the PVD chamber includes a cover ring disposed about the substrate support and having a texturized outer surface, and wherein a silicon nitride (SiN) layer having a first thickness is deposited onto the texturized outer surface during each of the plurality of first deposition processes; and performing a second deposition process on the cover ring between subsets of the plurality of first deposition processes to deposit an amorphous silicon layer having a second thickness onto an underlying silicon nitride (SiN) layer.

Methods of reducing particles in a physical vapor deposition (PVD) chamber

Growing community of inventors

Sunnyvale, CA, United States of America

Wei Dou