Chipmos Technologies Inc.

Wei David Wang

Geng Shin Shen

An Hong Liu

Yu Ting Yang

Hung Hsin Liu

Tzu Hsin Huang

Shih Fu Lee

A thermally enhanced electronic package comprises a driver chip, an insulator, a flexible carrier, and carbon nanocapsules. The flexible carrier includes a flexible substrate, a wiring layer formed on the substrate, and a resistant overlaying the wiring layer. The driver chip is connected to the wiring layer. The insulator is filled in the gap between the driver chip and the flexible carrier. The carbon nanocapsules are disposed on the driver chip, on the resistant, on the flexible carrier, or in the insulator to enhance heat dissipation of electronic packages.

Growing community of inventors

Tainan County, Taiwan

Wei David Wang