Htc Corporation

Xintec Corporation

Other

Wei-Chung Yang

Chien-Hung Liu

Ying-Nan Wen

Ho-Yin Yiu

Zih-Ci Lin

Ruey-Jer Chang

Shu-Ming Chang

Bai-Yao Lou

Chun-Hsiang Huang

Shih-Yi Lee

Yen-Shih Ho

Chia-Ming Cheng

Po-Han Lee

Ching-Liang Chiang

Cheng-Shiun Jan

Hung-Jen Lee

Ying-Chung Chen

Chun-Wei Hsu

Lun-Cheng Chu

Kuan-Jung Wu

A chip package is provided. A first bonding structure is disposed on a first redistribution layer (RDL). A first chip includes a sensing region and a conductive pad that are adjacent to an active surface. The first chip is bonded onto the first RDL through the first bonding structure. The first bonding structure is disposed between the conductive pad and the first RDL. A molding layer covers the first RDL and surrounds the first chip. A second RDL is disposed on the molding layer and the first chip and is electrically connected to the first RDL. A second chip is stacked on a non-active surface of the first chip and is electrically connected to the first chip through the second RDL, the first RDL, and the first bonding structure. A method of forming the chip package is also provided.

Chip package and method for forming the same

A chip package including a first substrate is provided. The first substrate includes a sensing device. A second substrate is attached onto the first substrate and includes an integrated circuit device. A first conductive structure is electrically connected to the sensing device and the integrated circuit device through a redistribution layer disposed on the first substrate. An insulating layer covers the first substrate, the second substrate and the redistribution layer. The insulating layer has a hole therein and a second conductive structure is disposed under the bottom of the hole. A method for forming the chip package is also provided.

A chip package is provided. The chip package includes a sensing device. The chip package also includes a first conductive structure disposed on the sensing device and electrically connected to the sensing device. The chip package further includes a chip and a second conductive structure disposed on the sensing device. The chip includes an integrated circuit device. The second conductive structure is positioned on the chip and is electrically connected to the integrated circuit device and the first conductive structure. In addition, the chip package includes an insulating layer covering the sensing device and the chip. The insulating layer has a hole. The first conductive structure is positioned under the bottom of the hole. The top surface of the insulating layer is coplanar with the top surface of the second conductive structure. A method for forming the chip package is also provided.

Chip package having chip connected to sensing device with redistribution layer in insulator layer

A chip package is provided. The chip package includes a substrate having conductive pads therein and adjacent to a first surface thereof. Chips are attached on a second surface opposite to the first surface of the substrate, and an encapsulation layer covers the chips. First redistribution layers are disposed between the second surface of the substrate and the encapsulation layer, and second redistribution layers are disposed on the encapsulation layer. First conductive structures and second conductive structures are disposed in the encapsulation layer. Each of first and second conductive structures respectively includes at least one bonding ball. The first conductive structures are configured to connect first and second redistribution layers, and the second conductive structures are configured to connect the second redistribution layers and the chip. A method of forming the chip package is also provided.

Chip package

Method for forming chip package having chip connected to sensing device with redistribution layer in insulator layer

An image editing method and an electronic device including a display unit are provided. In the method, a first image is captured and displayed on the display unit. A first object is extracted from the first image, and a second object in the first image is detected. A second image is captured and the second object in the second image is detected. A movement of the second object is obtained according to the first image and the second image, and the first object on the display unit is moved along with the movement of the second object. Accordingly, an object in a photo can be moved by using images.

Image editing method and electronic device using the same

A mobile device and an information protection method are presented. The mobile device includes a sensor, a storage and a processor that is electrically connected with the sensor and the storage. The sensor is configured to sense at least one electronic device. The processor is configured to determine an authority of the at least one electronic device and define a protection state for at least one part of the information stored in the storage according to the authority. The information protection method is applied to the mobile device to implement the aforesaid operations.

Mobile device and information protection method thereof

A method, an electronic apparatus, and a computer readable medium for processing reflection in an image are proposed. In the method, a first image and a second image are obtained. A plurality of objects in the first image and the second image are recognized and a plurality of lighting regions having a brightness higher than a first threshold in the first image and the second image are detected. Then, a plurality of displacements between corresponding objects and corresponding lighting regions in the first image and the second image are calculated. It is determined whether a ratio of the displacement of the object nearby one of the lighting regions to the displacement of the lighting region is over a second threshold. Finally, the lighting region is determined as a reflection if the ratio is over the second threshold.

Method, electronic apparatus, and computer readable medium for processing reflection in image

A method for searching wireless signal, a mobile electronic device using the same, and a non-transitory storage medium are provided. In the method, after a motion sensor of the mobile electronic device is activated, a motion status of the mobile electronic device is determined by using the motion sensor. Then, a frequency of the mobile electronic device performing a wireless signal searching procedure is adjusted according to the motion status, so as to reduce power wasted due to the unnecessary wireless signal searching procedure being performed.

Method for searching wireless signal, mobile electronic device using the same, and non-transitory storage medium

A power module includes a substrate; a conductive path layer formed on the substrate with a specific pattern as an inductor; a connection layer being formed on the substrate and electrically connected to a first terminal of the inductor; and a first transistor, electrically mounted on the substrate through the connection layer.

Power module and the method of packaging the same

A method for controlling a surrounding device and a communication device and a computer-readable medium using the same are proposed. The proposed method is adapted for a communication device, and includes following procedures. Firstly, a connection with a surrounding device is established through a wireless communication function. Then, a target setting value associated with a setting of the surrounding device is stored. Further, it is determined whether the communication device receives a communication request. Moreover, when the communication device receives the communication request, the setting of the surrounding device is modified from an original setting value to the target setting value.

Method for controlling surrounding device and communication device and computer-readable medium using the same

Embodiments of the present invention provide a capacitive coupler packaging structure including a substrate with at least one capacitor and a receiver formed thereon, wherein the at least one capacitor at least includes a first electrode layer, a second electrode layer and a capacitor dielectric layer therebetween, and the first electrode layer is electrically connected to the receiver via a solder ball. The capacitive coupler packaging structure also includes a transmitter electrically connecting to the capacitor.

Capacitive coupler packaging structure

An embodiment of the present invention provides a manufacturing method of an interposer including: providing a semiconductor substrate having a first surface, a second surface and at least a through hole connecting the first surface to the second surface; electrocoating a polymer layer on the first surface, the second surface and an inner wall of the through hole; and forming a wiring layer on the electrocoating polymer layer, wherein the wiring layer extends from the first surface to the second surface via the inner wall of the through hole. Another embodiment of the present invention provides an interposer.

Interposer and manufacturing method thereof

A chip package includes: a substrate; a drain and a source regions located in the substrate; a gate located on or buried in the substrate; a drain conducting structure, a source conducting structure, and a gate conducting structure, disposed on the substrate and electrically connected to the drain region, the source region, and the gate, respectively; a second substrate disposed beside the substrate; a second drain and a second source region located in the second substrate, wherein the second drain region is electrically connected to the source region; a second gate located on or buried in the second substrate; and a second source and a second gate conducting structure disposed on the second substrate and electrically connected to the second source region and the second gate, respectively, wherein terminal points of the drain, the source, the gate, the second source, and the second gate conducting structures are substantially coplanar.

Growing community of inventors

Taoyuan, Taiwan

Wei-Chung Yang