Getac Technology Corporation

Compal Electronics, Inc.

Mitac Technology Corporation

Wei-Chung Hsiao

Yu-Chiang Cheng

Chao-Yi Chen

Hsuan-Cheng Wang

Ming-Hang Hwang

Hsin-Lung Kuo

Bin-Wei Lee

Chun-Hung Lin

Shuan-Yeong Ju

Chun-Chi Wang

Chi-Wei Tien

Hung-Chan Cheng

Ruei-Rong Lin

Yu-Ling Fu

Ping-Feng Lee

Tsung-Hui Wu

The vehicle camera includes a camera main body and two thermal insulation components. The camera main body has two side surfaces facing away from each other. The two thermal insulation components are respectively disposed on the side surfaces of the camera main body facing away from each other. Thermal conductivities of the two thermal insulation components are smaller than a thermal conductivity of the camera main body.

Vehicle camera

The present invention relates to a heat dissipation module and an assembly method thereof. The heat dissipation module includes a heat conductive plate and a buffer member. The heat conductive plate includes a cover section and a first extension section. The cover section covers a heat zone. The buffer member is provided at the heat conductive plate to interferingly match with a housing, so as to conduct heat energy produced by the heat zone to the housing. Accordingly, by configuring the buffer member between the heat conductive plate and the housing, the heat conductive plate is allowed to be reliably thermally adhered to the housing, thereby achieving enhanced heat dissipation efficiency for the heat dissipation module.

Heat dissipation module and assembly method thereof

A management method for an information capturing system includes: detecting communication connections of a plurality of information capturing devices; and when the communication connection of any of the information capturing device is abnormal, generating and outputting a trigger signal to the other of the information capturing devices so as to cause the other of the information capturing devices to execute an information capturing process in response to the trigger signal.

Event detecting and recording system, management method and activating method for information capturing device

A bendable heat plate is provided. The heat plate includes a housing, a micro-structural layer and a fluid. The housing has an inner surface and an enclosed internal space, and includes a bendable section provided with a channel maintaining structure. The micro-structural layer is formed on the inner surface of the housing. The fluid is filled in the internal space. Using the channel maintaining structure, the bendable section is provided with sufficient space for the fluid to pass through.

Bendable heat plate

A wave absorbing heat dissipation structure adapted to absorb electromagnetic waves of an electronic component and dissipate heat energy of the electronic component. The wave absorbing heat dissipation structure includes a wave absorbing heat dissipation layer and a metal film. The wave absorbing heat dissipation layer is provided at an electronic device, and has a first surface and a second surface opposite to each other, wherein the first surface covers the electronic component. The metal film covers the second surface. The wave absorbing heat dissipation layer is adapted to absorb electromagnetic waves and transmit heat energy. The metal film is adapted to reflect electromagnetic waves and dissipate heat energy. The wave absorbing heat dissipation structure is capable of alleviating interference of electromagnetic waves on an electronic component and enhancing heat dissipation of an electronic component.

Wave absorbing heat dissipation structure

A heat dissipation and shockproof structure for an electronic module with a hard disk drive is provided. The heat dissipation and shockproof structure includes a carrying component and an elastomer. The carrying component has a fixed segment and two first extending segments. The first extending segments are connected to two ends of the fixed segment, respectively. The fixed segment is connected to a lateral surface of the hard disk drive. The distance between the first extending segments is greater than the thickness of the hard disk drive. The elastomer is disposed partially on the first extending segments at the very least.

Heat dissipation and shockproof structure

A decryption method for use in displaying data includes the steps of executing a display instruction of an object inclusive of a plurality of data, displaying an unencrypted data, but not an encrypted data, of the data on a display unit according to the display instruction, detecting a trigger signal during the state of displaying the unencrypted data but not displaying the encrypted data, entering a password-receiving state in response to the trigger signal and detecting a password signal during the password-receiving state, determining whether the password signal matches a default password, and displaying the unencrypted data and the encrypted data on the display unit when the password signal matches the default password. Therefore, with the decryption method, no person other than the object owner is aware of the encrypted data.

Decryption method for use in displaying data

A controlling method for protecting an electronic apparatus, performed by the electronic apparatus to determine whether the system temperature thereof is overheated, so as to switch the electronic apparatus into a low-power operation mode when the system temperature is overheated. The controlling method is to monitor an electronic component of the electronic apparatus, so as to obtain the current temperature and the current working power of the electronic component and to determine whether the system temperature is overheated according to the current temperature and the current working power. When the system temperature is overheated, an overheating signal is generated to switch the electronic apparatus into the low-power operation mode.

Apparatus and method of protecting electronic apparatus using a temperature-power table for an electronic component under different system and environmental temperatures

The disclosure relates to a method, circuit, and electronic device for controlling a rotation speed of a fan. The method provides a multistage function curve associates temperatures with rotation speed values. The multistage function curve comprises a first steady-state function segment with slope of zero, a second steady-state function segment with slope of zero and N function segments positioned between the first and second steady-state function segments. N is a positive integer. The slope of a (i+1)function segment is greater than that of an ifunction segment, and i is a positive integer in the range from 1 to N. The electronic device comprising the circuit may use the temperature of the processor based on the multistage function curve to dynamically control the rotation speed.

Method, circuit, and electronic device for controlling rotation speed of fan

An image presentation angle adjustment method is provided for a camera device to process images through the method. An image presentation angle assigning device module is integrated in the camera device. When the camera device captures a target image, the image presentation angle assigning device will automatically or through the operation of a user generate an image orientation parameter associated with the target image. Furthermore, the captured target image is stored in an image file within the image storage memory of the camera device associated with the image orientation parameter. Accordingly, when the target image is opened by the user for display, the target image will be displayed in the orientation indicated the image orientation parameter for viewing convenience.

Image presentation angle adjustment method and camera device using the same

A heat pipe structure including a pipe body and a working substance is provided. The pipe body has two closed ends opposite to each other, an inner surface, a compressed portion, and an expanded portion. The inner surface and the two closed ends form a cavity. The compressed portion includes a plurality of first grooves formed at the inner surface. Any one of the first grooves includes a first width. The expanded portion includes a plurality of second grooves formed at the inner surface. Any one of the second grooves includes a second width, and the first width is approximately equal to the second width. The working substance is contained in the cavity.

Heat pipe structure and flattened heat pipe structure

This invention discloses a manufacturing method and a structure for printed circuit boards. The printed circuit boards are often used for supporting electronic components in circuit and conducting the heat from electronic components. The printed circuit board structure includes a laminated structure. The laminated structure comprises an electric conduction layer and an insulation layer. The electric conduction layer can be made of a special thermal conduction material, including a metal and a bracket structure of carbon element. The insulation layer can be made of thermal conduction material as well, combining a bracket structure of carbon element. The bracket structure of carbon element has high thermal conductivity so as to improve the heat conduction efficiency. The corresponding manufacturing method for this thermal conduction material can be made with chemical vapor deposition, physical vapor deposition, electroplating or the other materials preparation method. The bracket structure of carbon element can be coated on a surface of the metal and also can be mixed into the metal.

Printed circuit board structure and manufacturing method thereof

This invention discloses a manufacturing method and a structure for a chip heat dissipation. This heat dissipation structure includes a bottom plate of circuit structure, a die of central processing unit and a cap. The cover is often used in conducting the waste heat generated from the chip. The cover can be made of a special thermal conduction material, including a metal and a bracket structure of carbon element which have high thermal conductivity so as to improve the efficiency of heat conduction. The corresponding manufacturing method for this heat conduction material can be made with chemical vapor deposition, physical vapor deposition, electroplating or the other materials preparation method. The bracket structure of carbon element can be coated on the metal surface and also can be mixed into the metal.

Chip heat dissipation structure and manufacturing method

A cooler module mounted on a CPU on a circuit board inside a computer is disclosed to include a mounting base frame, which is made of a thermal conductive material and has a heat-transfer zone disposed in contact with the CPU and two arms respectively extended from two sides of the heat-transfer zone and affixed to the circuit board and two eyelet lugs vertically extended from two sides of the distal end of one of the two arms, a heat pipe, which has one end supported on the heat-transfer zone of the mounting base frame, an elongated retaining member, which has two lugs disposed at one end thereof and respectively fastened to the eyelet lugs of the mounting base frame, and a buffer member fastened to the heat-transfer zone to hold down heat pipe on the heat-transfer zone.

Growing community of inventors

Taipei, Taiwan

Wei-Chung Hsiao