Wei-Chun Hsueh

Chun-Yuan Huang

A bonding device for a wearable device includes a first bonding structure and a second bonding structure. The first bonding structure includes a first wire connecting member, a first bonding member and an elastic member, and has a plurality of first mechanical structures configured to form a first mechanical bond and a plurality of first electrical contacts configured to form a first electrical bond, and the second bonding structure includes a first signal connecting line, wherein the first wire connecting member, the first bonding member, and the elastic member form the first mechanical bond through the plurality of first mechanical structures; the first wire connecting member, the first bonding member, and the elastic member form the first electrical bond through the plurality of first electrical contacts; and the elastic member is electrically connected to the first signal connecting line to combine the first bonding structure and the second bonding structure.

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Hsinchu, Taiwan

Wei-Chun Hsueh