Ali Corporation

Acer Laboratories Inc.

Wei-Chou Hung

Chun-Ming Chen

Yu-Ling Chiu

Chih Long Dai

A wire bonding package has a housing having a plurality of pins, a circuit board installed inside the housing and having at least a trace connected to a pin of the housing, at least a die installed on the circuit board and having a plurality of bonding pads, and at least a bonding line connected between a bonding pad of the die and the trace of the circuit board so that the bonding pad of the die is electrically connected to the pin of the housing.

Wire bonding package

The long seek control system and method include a reference velocity mapping unit that obtains a reference velocity when the dual actuator is moved by the residual track count; a velocity estimator for outputting an estimated velocity and obtaining a sled control effort by subtracting the estimated velocity from the reference velocity; and an electrical damper for receiving the sled control effort and simultaneously receiving the displacement of the dual actuator to output a damping control effort to the fine actuator, and reduce the vibration of the fine actuator during the long seek operation. In the reference velocity mapping unit, a reference velocity curve is used to describe the mapping relation between the residual track count and the reference velocity. The reference velocity curve includes a linear part and several quadratic parts with different quadratic functions.

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Taipei, Taiwan

Wei-Chou Hung