Taiwan Semiconductor Manufacturing Comp. Ltd.

Tenx Technology Inc.

Wei-Chih Yeh

Oscar M K Law

Kuo H Wu

Cheng-Hung Huang

Bo-Wen Cheng

A method for sending a keycode of a non-keyboard apparatus is provided and includes the following steps. The non-keyboard apparatus determines the connection status between itself and a computer by the time required for device enumeration. Then, according to a value generated from device enumeration, the non-keyboard apparatus identifies the kind of operating system running on the computer. The non-keyboard apparatus sends to the computer a keycode corresponding to the Num Lock key and/or a keycode corresponding to the Caps Lock key such that a sending time and a feedback time are obtained. A parameter related to the efficiency of the computer is then calculated based.

Method for sending a keycode of a non-keyboard apparatus

An integrated circuit structure includes a chip including a substrate and a power distribution network. The power distribution network includes a plurality of power through-silicon vias (TSVs) penetrating the substrate, wherein the plurality of power TSVs forms a grid; and a plurality of metal lines in a bottom metallization layer (M), wherein the plurality of metal lines couples the plurality of power TSVs to integrated circuit devices on the substrate.

Supplying power to integrated circuits using a grid matrix formed of through-silicon vias

A through silicon via architecture for integrated circuits is provided. The integrated circuit (IC) includes a substrate with a top surface and a bottom surface with circuitry formed on the top surface, a plurality of bonding pads formed along a periphery of the bottom surface, and a backside metal layer (BML) formed on the bottom surface and electrically coupled to a second subset of bonding pads in the plurality of bonding pads. A first subset of bonding pads in the plurality of bonding pads is electrically coupled to circuitry on the top surface with through silicon vias (TSV). The BML distributes electrical signals provided by the second subset of bonding pads.

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Taipei, Taiwan

Wei-Chih Yeh