Asia Electronic Material Co., Ltd.

Wei-Chih Lee

Chien-Hui Lee

Chih-Ming Lin

Li-Chih Yang

Chia-Hua Ho

An electromagnetic interference shielding film includes an insulation layer, a first adhesive layer, a porous metal layer and a conductive adhesive layer including a plurality of conductive particles. The first adhesive layer is located between the insulation layer and the porous metal layer, and the porous metal layer is formed on the first adhesive layer, and making the first adhesive layer locate between the porous metal layer and the insulation layer. The conductive adhesive layer is located on the porous metal layer so that the porous metal layer is located between the first adhesive layer and the conductive adhesive layer. The present invention further provides a preparation method thereof.

Electromagnetic interference shielding film and preparing methods thereof

A colored thin covering film is provided, including an upper detached layer, a colored ink film, a low dielectric glue layer, and a lower detached layer. The color ink layer is formed between the upper detached layer and the low dielectric glue layer. The low dielectric glue layer is formed between the colored ink layer and the lower detached layer. The thickness of the colored ink layer is between 1 to 10 &#x3bc;m, and the thickness of the low dielectric glue layer is between 3 to 25 &#x3bc;m, such that a total thickness of the colored ink layer and the low dielectric glue layer is allowed to be between 4 to 35 &#x3bc;m. The colored thin covering film has an extremely low dielectric constant and loss, extremely low ion migration, good adhesion, heat dissipation, high flexibility, and low resilience, and can be processed in a low temperature.

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Zhubei, Taiwan

Wei-Chih Lee