Omnivision Technologies, Inc.

Wei-Chih Chien

Wei-Feng Lin

Ying-Chih Kuo

An image sensor package, comprising a silicon substrate; an image sensor pixel array that is formed on the silicon substrate; a peripheral circuit region that is formed around the image sensor pixel array on the silicon substrate; a redistribution layer (RDL) that is electrically coupled to the peripheral circuit region; at least one solder ball that is electrically coupled to the RDL; and a cover glass that is coupled to the RDL. No part of the RDL is located directly above or below the image sensor pixel array. No part of the at least one solder ball is located directly above or below the silicon substrate. A dark material layer is implemented to prevent an edge flare effect of the image sensor pixel array.

Image sensor package to limit package height and reduce edge flare

A short-resistant CSP includes an isolation layer, an electrically conductive RDL, and an insulating layer. The electrically conductive RDL is on the isolation layer and includes a first and a second RDL segment. The insulating layer includes a first insulator portion between the isolation layer and the first RDL segment to improve electrical isolation between the first and second RDL segments. A method for preventing short-circuiting between conductors of CSP includes (1) depositing a first insulating layer on a first substrate region, (2) depositing a RDL segment on the substrate above the first substrate region, at least a portion of the first insulating layer being between the first RDL segment and the first substrate region, and (3) depositing a second RDL segment on the substrate above a second substrate region, such that the first insulating layer interrupts a leakage current path between the first and second RDL segments.

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Zhubei, Taiwan

Wei-Chih Chien