Taiwan Semiconductor Manufacturing Comp. Ltd.

Wistron Corporation

Tdk Taiwan Corporation

Acer Inc.

Giga-byte Technology Co., Ltd.

Chunghwa Precision Test Tech. Co., Ltd.

Wistron Crop.

Wei-Cheng Wang

Shih-Hang Chiu

Chi On Chui

Shou-Jen Liu

Jian-Hao Chen

Shao-Chung Chang

Kuan-Ting Liu

Chia-Wei Chen

Chien-Lun Huang

Po-Yuan Hsu

Hsing-Wang Chang

Feng-Ning Lee

Fu-Yuan Wu

Kuo-Feng Yu

Chung-Chiang Wu

Hui-Chi Chen

Tsung-Hsien Chen

Chia-Cheng Su

Yen-Ju Chen

Wei Cheng Hsu

Chen-Yu Li

Bing-Yuan Cheng

Hsiang Yin Shen

Chih-Wei Huang

Jo-Chun Hung

Shao-Chi Chuang

Chun-Chih Cheng

Wen-Chi Chien

Yung-Ho Chen

Wei-Pin Huang

Wen-Chieh Tsou

Chia-Cheng Chang

Sin-Jhong Song

Chia-Ming Tsai

Miin-Jang Chen

Chih-Chung Chen

Chi-Feng Tung

Chin-Kun Wang

Che-Hsiang Chiu

Chao-Chun Chang

Sin-Hong Lin

Tsung-Ying Tsai

Liang-Chen Chi

Li-Jen Ko

Mao-Lin Kao

Yuh-Dean Tsai

Hsin-Hao Chen

Keng-Hsien Yang

Yu-Hua Chang

Wei-Chen Hsiao

Chia-Neng Yang

Huan-Yuan Huang

Shin-tsung Chen

Hsueh-Fen Liao

Yueh-Tsung Ho

Tzu-Wei Wang

A method according to the present disclosure includes providing a substrate that includes a dummy gate stack wrapping over an active region, and a spacer layer extending along sidewalls of the dummy gate stack, selectively removing the dummy gate stack to form a gate trench exposing the active region, depositing a gate dielectric over the active region, depositing at least one work function layer over the gate dielectric layer, depositing a tungsten layer over the at least one work function layer, and depositing a tungsten nitride layer over the tungsten layer.

Gate structures for multi-gate devices

A driving mechanism is provided, including a fixed part, a movable part for holding an optical element, a driving assembly, a circuit board, and conductive element. The driving assembly is used for driving the movable part to move relative to the fixed part. The circuit board is disposed on the fixed part, having a conductive portion exposed to an outer surface of the circuit board. The conductive element forms a longitudinal end portion not parallel to the outer surface of the circuit board, wherein the conductive element is electrically connected to the driving assembly and the conductive portion of the circuit board.

Driving mechanism

A semiconductor device includes stacks of nano-structures that each extend in a first horizontal direction. The stacks each extend in a vertical direction and are separated from one another in a second horizontal direction. A first gate is disposed over a first subset of the stacks. A second gate is disposed over a second subset of the stacks. A first conductive capping layer is disposed over a substantial entirety of an upper surface of the first gate. A second conductive capping layer is disposed over a substantial entirety of an upper surface of the second gate. A dielectric structure is disposed between the first gate and the second gate in the second horizontal direction. The dielectric structure physically and electrically separates the first gate and the second gate. An upper surface of the dielectric structure is substantially free of having the first or second conductive capping layers disposed thereon.

Forming low-resistance capping layer over metal gate electrode

A semiconductor structure and a method of forming the same are provided. In an embodiment, an exemplary semiconductor structure includes a gate structure. The gate structure includes a gate dielectric layer, an n-type work function layer embedded in the gate dielectric layer, a dielectric capping layer embedded in the n-type work function layer, and a p-type work function layer embedded in the dielectric capping layer. A top surface of the gate structure exposes the n-type work function layer, the dielectric capping layer, and the p-type work function layer. The semiconductor structure also includes a first metal cap on the n-type work function layer and a second metal cap on the p-type work function layer. The first metal cap is spaced apart from the second metal cap. without formed on the dielectric capping layer.

Metal caps for gate structures

Embodiments provide a replacement metal gate in a FinFET or nanoFET which utilizes a conductive metal fill. The conductive metal fill has an upper surface which has a fin shape which may be used for a self-aligned contact.

Method of forming metal gate fin electrode structure by etching back metal fill

Semiconductor devices having improved gate electrode structures and methods of forming the same are disclosed. In an embodiment, a semiconductor device includes a gate structure over a semiconductor substrate, the gate structure including a high-k dielectric layer; an n-type work function layer over the high-k dielectric layer; an anti-reaction layer over the n-type work function layer, the anti-reaction layer including a dielectric material; a p-type work function layer over the anti-reaction layer, the p-type work function layer covering top surfaces of the anti-reaction layer; and a conductive cap layer over the p-type work function layer.

Semiconductor device and method

A semiconductor device includes a plurality of active region structures that each protrude upwards in a vertical direction. The active region structures each extend in a first horizontal direction. The active region structures are separated from one another in a second horizontal direction different from the first horizontal direction. A gate structure is disposed over the active region structures. The gate structure extends in the second horizontal direction. The gate structure partially wraps around each of the active region structures. A conductive capping layer is disposed over the gate structure. A gate via is disposed over the conductive capping layer. A dimension of the conductive capping layer measured in the second horizontal direction is substantially greater than a maximum dimension of the gate via measured in the second horizontal direction.

The present disclosure provides a semiconductor device and a method of forming the same. The semiconductor device includes a first channel members being vertically stacked, a second channel members being vertically stacked, an n-type work function layer wrapping around each of the first channel members, a first p-type work function layer over the n-type work function layer and wrapping around each of the first channel members, a second p-type work function layer wrapping around each of the second channel members, a third p-type work function layer over the second p-type work function layer and wrapping around each of the second channel members, and a gate cap layer over a top surface of the first p-type work function layer and a top surface of the third p-type work function layer such that the gate cap layer electrically couples the first p-type work function layer and the third p-type work function layer.

Metal gate cap

An optical driving mechanism is provided, for driving an optical element, including: a fixed portion, a movable portion, a driving assembly and a position sensing assembly. The movable portion is movably connected to the fixed portion and includes a holder for sustaining the optical element. The driving assembly is configured to drive the movable portion to move relative to the fixed portion. The position sensing assembly is configured to sense a distance of the movable portion relative to the fixed portion, the position sensing assembly includes a sensing magnetic element and a sensor, wherein the sensing magnetic element is disposed on the movable portion and has a rectangular structure. A direction of a long axis of the rectangular structure extends in a direction that is perpendicular to the optical axis of the optical element, and the direction of the long axis is different from the optical axis direction.

Optical driving mechanism

A driving system for moving several optical elements is provided, including a first module, a second module and a third module. The first, second and third modules respectively have a first, second and third terminal electrically connected an external circuit. The first terminal is on a first side of the first module, the second terminal is on a second side of the second module, and the third terminal is on a third side of the third module. Specifically, the first, second, and third terminals are located on the same side of the driving system.

Driving system

An optical member driving mechanism for driving an optical member having an optical axis is provided, including a fixed portion, a movable portion, a driving assembly, and a circuit board. The fixed portion includes a case and a frame, and a gap is formed therebetween. The movable portion is movably connected to the fixed portion, and configured to hold the optical member. The driving assembly can drive the movable portion to move relative to the fixed portion. The circuit board is disposed in the gap, and has a plate portion and a protruding portion. The protruding portion is disposed between the plate portion and the fixed portion, so as to tightly dispose the circuit board in the gap.

Optical member driving mechanism

A power management system includes connection interfaces, a system power supply, and a power management circuit. Each connection interface is connected to one power consumption device. The system power supply includes power supply units (PSUs). The system power supply supplies electricity power to each power consumption device via one connection interface. The power management circuit is connected to each power consumption device via the connection interfaces. The power management circuit obtains a current total load of PSUs, determines a target load of each PSU, and determines whether each connection interface is connected to one power consumption device. The power management circuit turns off power supply to the connection interface that is not connected to the power consumption devices. According to the current total load and the target load, the power management circuit determines an enabled number of the PSUs, thereby turning on or turning off each PSU accordingly.

Power management system and power management method for computer system

A driving mechanism is provided, including a fixed part, a movable part for holding an optical element, a driving assembly, and a circuit board. The driving assembly is used for driving the movable part to move relative to the fixed part. The circuit board is disposed on the fixed part, having a conductive portion exposed to an outer surface of the circuit board and a trace embedded in the circuit board. The conductive portion and the trace partially overlap when viewed in a horizontal direction perpendicular to the optical axis of the optical element.

Growing community of inventors

Jongli, Taiwan

Wei-Cheng Wang