Clevo Co.

Quanta Computer Incorporated

Wei-Cheng Liao

Ping-Sheng Kao

Po-Hsuan Chen

Jih-Sheng Yeh

Guan-You Chen

Jer-Kuang Lu

Bo-Xuan Chen

A heat dissipation structure includes a heat dissipation member and a fixed member. The fixed member has a first surface and a second surface oppositely. The heat dissipation member is disposed on the first surface, and one part of the second surface corresponds to one side of at least one heat generating source and is disposed adjacent to the one side of the heat generating source. The first surface has a first zone surrounded by a second zone. The heat dissipation member is disposed on the first zone corresponding to the heat generating source. The second zone has at least one groove arranged around one part of the first zone. A distance between one side of the groove adjacent to the first zone and the first zone is less than 1.0 mm, and a volume ratio of the groove to the heat dissipation member is 0.9 to 1.6.

Heat dissipation structure

A dustproof device for laptops comprises a heat dissipating device disposed in a laptop to form a dustproof device for the same, wherein the heat dissipating device is disposed on a main computing unit in an interior of the laptop; the heat dissipating device includes a fan set and a heat dissipating fin. The fan set includes a housing, a rotating section and a guiding device, wherein on a lateral side of the housing is disposed an opening, the rotating section is disposed inside the housing, the guiding device is disposed inside the housing between the rotating section and a lateral side of the opening, and a dust removing path is formed between the guiding device and an inner wall surface of the housing adjacent to the guiding device. The heat dissipating fin is correspondingly disposed on the opening of the fan set, and an indented section is disposed in the heat dissipating fin in correspondence with the dust removing path to allow dust to be blown out of the laptop through the indented section while the laptop is performing dust removal without a need to dispose a dust removing hole on the housing of the laptop.

Dustproof device for laptops

A heat dissipating module includes a bottom cover, a top cover, a fan body, and a heat dissipating structure. The top cover is disposed opposite the bottom cover, in which an air outlet is formed by the top cover and the bottom cover. The fan body is disposed between the top cover and the bottom cover, and the fan body provides an airflow toward the air outlet. The heat dissipating structure is disposed in front of the air outlet, in which the heat dissipating structure and the bottom cover are formed with a one-piece metal sheet. The heat dissipating structure is bent from the bottom cover toward the air outlet. The heat dissipating structure includes openings, such that the airflow passes through the openings from the air outlet and performs heat exchange with the heat dissipating structure.

Heat dissipating module

Growing community of inventors

Taipei, Taiwan

Wei-Cheng Liao