Wistron Corporation

Wei-Cheng Chou

Ming-Chih Chen

Yao-Tsung Chang

Ai-Tsung Li

Chen-Hsien Chuang

Al-Tsung Li

A fan control system and a fan controlling method thereof are disclosed. The fan control system is used to an electronic apparatus for controlling an air pump fan device. The fan controlling method includes following steps: setting a plurality of vibrating working periods of the air pump fan device; setting a plurality of vibrating frequencies of the air pump fan device, wherein each vibrating frequency has a different vibrating frequency value; detecting a temperature of the electronic apparatus; determining whether the temperature of the electronic apparatus exceeding a first setting temperature; and if yes, controlling the air pump fan device to vibrate according to the plurality of vibrating frequencies during the plurality of vibrating working periods, wherein adjacent vibrating working periods of the plurality of vibrating working periods correspond to different vibrating frequency values.

Fan control system and fan controlling method thereof

The method of manufacturing heat pipe is disclosed to insert a center bar into a metal tube such that the center bar contacts a clearance area of the inner sidewall of the metal tube. Then, the method is to fill the interval between the center bar and the metal tube with powder for sintering. At last, the method is to perform a sintering, extract the center bar, inject working fluid, and close the metal tube. A heat pipe is therefore formed. Because of no sintered powder on the clearance area, the heat pipe can be bent at the clearance area without damaging the capillary structure formed by the sintered powder. The flow path of the working fluid is not interrupted or influenced, so the heat transfer efficiency can be maintained, which overcomes the decrement of the heat transfer efficiency of a bent heat pipe in the prior art.

Heat pipe and method of manufacturing a heat pipe

A heat dissipating mechanism includes a first housing, a second housing and a tributary hole structure. The first housing is installed on a host casing. At least one inlet and at least one outlet are formed on two sides of the first housing. The second housing combines with the first housing, and the second housing and the host casing form a flow channel for communicating with the at least one inlet and the at least one outlet, so as to guide liquid from the at least one inlet to the at least one outlet. The tributary hole structure is formed on the flow channel and located in a position between the at least one inlet and the at least one outlet. The tributary hole structure is higher than the at least one outlet for guiding air from the at least one inlet to a fan.

Heat dissipating mechanism adapted to an electronic device and electronic device therewith

A portable electrical device with heat dissipation mechanism includes a housing with an acoustic hole, an earphone receptacle with a earphone hole, and two fans. The earphone receptacle and the fans are disposed in the housing. The fans are respectively located adjacent to the acoustic hole and the earphone hole, and generate airflow passing through the acoustic hole and the earphone hole. Thus, the portable electrical device dissipating heat utilizes the holes existing on the housing, without additional heat-dissipation holes.

Portable electrical device with heat dissipation mechanism

A thermal module includes a fan device having a fan and a fan housing for covering the fan. A vent is disposed on the fan housing. The thermal module further includes an airflow guiding device installed on the fan housing in a protrudable manner and disposed on a side of the vent for guiding airflow into the vent.

Thermal module with airflow guiding function

An electronic device includes a housing unit, a first electronic component, a heat-dissipating module, and an air-guide passage. The first electronic component, the heat-dissipating module, and the air-guide passage are disposed in the housing unit. The heat-dissipating module includes a fan unit and a heat-dissipating sink. The fan unit has a first air outlet zone and a second air outlet zone. The heat-dissipating sink is for dissipating heat generated by the first electronic component. The heat-dissipating sink is substantially aligned with the first air outlet zone. The air-guide passage is in spatial communication with the second air outlet zone and is formed with a passage air outlet. Air through the first air outlet zone flows in a first direction. Air through the passage air outlet is directed into the housing unit and flows in a second direction different from the first direction.

Electronic device

The disclosure provides a method for fabricating a heat pipe, and an instrument of the method. The method for fabricating a heat pipe includes providing a hollow tube, wherein the hollow tube has an open end and a closed end; disposing a mandril into the hollow tube from the open end, wherein the inside wall of the hollow tube is separated from the mandril by a space, and wherein the mandril comprises a first portion and a second portion and the first portion has a thermal expansion coefficient larger than that of the second portion; filling up the space between the mandril and the hollow tube with a powder; performing a sintering process to the hollow tube, forming a first agglomeration region and a second agglomeration region; removing the mandril; injecting a working fluid into the hollow tube; and sealing the open end of the hollow tube.

Method for fabricating a heat pipe, and instrument of the method

A thermal module includes a fan device having a fan and a fan housing for covering the fan. A vent is disposed on the fan housing. The thermal module further includes an airflow guiding device installed on the fan housing and disposed on a side of the vent for guiding airflow into the vent.

A housing for a centrifugal fan includes a surrounding wall extending upwardly from a periphery of a bottom wall with an air inlet, and including a surrounding wall body defining an opening, a protruding wall body extending outwardly from the surrounding wall body, corresponding to the opening, and having a dust-discharging hole, and a shielding plate disposed on the protruding wall body. The surrounding wall body and the bottom wall cooperatively define an accommodation space communicated with the air inlet, and an air outlet communicated with the accommodation space. The protruding wall body, the shielding plate, and the bottom wall cooperatively define a turbulence space communicated with the accommodation space. The shielding plate is movable between a closed position to close the dust-discharging hole, and an open position to open the dust-discharging hole so as to permit fluid communication between the turbulence space and the outside environment.

Growing community of inventors

Taipei, Taiwan

Wei-Cheng Chou